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"ACM SIGCHI General Interest Announcements (Mailing List)" <[log in to unmask]>
Tue, 11 Oct 2005 14:41:33 +0200
Luca Chittaro <[log in to unmask]>
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Luca Chittaro <[log in to unmask]>
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                                CALL FOR PAPERS

                                   Web3D 2006

             The 11th International Symposium on 3D Web Technology
                                April 18-21, 2006
                             Columbia, Maryland, USA


                            Sponsored by ACM SIGGRAPH
            In cooperation with the Web3D Consortium and Eurographics


Eleventh in the series, the 2006 International Web3D Symposium will  
address a wide range of 3D technologies on the Internet, ranging from  
languages, tools and high performance 3D graphics 
to human-computer interaction issues  and the
latest mobile applications. The annual Web3D Symposium is a major  
event which unites researchers, developers, experimenters, 
and content creators in a dynamic learning environment. 
Attendees share and explore methods of  using,
enhancing, or creating new 3D Web technology, such as X3D, VRML, MPEG4,
OpenHSF, and Java3D. Authors are invited to submit their work for  
review by the international Program Committee. Both research and applications  
papers are of interest to Web3D 2006. The papers must be innovative and  
contribute to the advancement of 3D technologies on the Web. 
Topics of interest include but are not limited to:

* 3D graphics for wireless PDAs and cellular phones.
* Animated humanoids and complex reactive characters.
* Computer Aided Design (CAD) technology and methods for lossless
   cross-application data exchange.
* Geometry/object behaviors in Web3D settings.
* High-performance 3D graphics for distributed environments and tele- 
  operation systems.
* Innovative user-interface paradigms for navigating real-time 3D  
  graphics environments and Web3D worlds.
* Interaction methods for Web-based 3D graphics systems.
* Methods for designing, representing, interacting with, and visualizing
   complex geometry, structure and behaviors.
* Multimodal user interaction in Web3D worlds.
* Web3D content for medical education, training and simulation.
* Innovative applications using 3D graphics on the Web and on mobile  
* Integration and interoperation with other XML-based Web standards.

Authors are invited to submit full papers of up to 9 pages (including  
figures and references) in PDF format via the Symposium Web Page. 
Papers must be formatted using the document templates for 
conferences sponsored by ACM SIGGRAPH. 
Accepted papers will appear in the Symposium Proceedings,  
published by ACM Press.

Paper submission deadline:      December 4, 2005
Tutorial proposals deadline:    December 4, 2005
Decision notification:          January 15, 2006
Final manuscript due:            February 5, 2006

General Chair:
* Denis Gracanin, Virginia Tech, USA

Program Co-Chairs:
* Julian Gomez, Polished Pixels, USA
* Roberto Ranon, University of Udine, Italy

Publicity Co-Chairs:
* Alan Hudson, Yumetech, USA
* Pablo Figueroa, Universidad de los Andes, Colombia

Local Arrangements Chair:
* Ben Benokraitis, Loyola College in Maryland, USA

Registration Chair:
* Mohamed Eltoweissy, Virginia Tech, USA

Tutorials Chair:
* Nicholas Polys, Virginia Tech, USA

Program Committee (additional members will be added soon):

    * Wolfgang Broll, Fraunhofer FIT, Germany
    * Don Brutzman, Naval Postgraduate School, USA
    * Len Bullard, Intergraph Corporation, USA
    * George S. Carson, GSC Associates, USA
    * Luca Chittaro, HCI Lab, University of Udine, Italy
    * Raimund Daschelt, Dresden University of Technology, Germany
    * David Duce, Oxford Brooks University, UK
    * Roger D. Eastman, Loyola College in Maryland, USA
    * Michael G. Hinchey, NASA Goddard Space Flight Center, USA
    * Nigel John, University of Wales, Bangor, UK
    * Nadia Magnenat-Thalmann, MIRALab-University of Geneva, Switzerland
    * Kresimir Matkovic, VRVis, Austria
    * Igor Pandzic, University of Zagreb, Croatia
    * Richard Puk, Intelligraphics Inc., USA
    * Werner Purgathofer, Vienna University of Technology, Austria
    * Sandy Ressler, NIST, USA
    * Alan Thomas, Naval Surface Warfare Center Dahlgren, USA

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