**************** SECOND Call for Papers ****************
******** TANGIBLE AND EMBEDDED INTERACTION 2008 ********
18-21 February 2008, b-it, Bonn, Germany
http://tei-conf.org
**PROGRAM CHAIRS:**
Elise van den Hoven Eindhoven University of Technology, NL
Ali Mazalek Georgia Institute of Technology, USA
**CONFERENCE CHAIRS:**
Albrecht Schmidt University of Bonn, Germany
Hans Gellersen Lancaster University, UK
**DATES AND LOCATION:**
Full submissions will be due October 5, 2007
Papers can be submitted online:
http://www.tei-conf.org/submission.html
TEI08 will take place 18-21 February 2008 in Bonn, Germany
=================== DESCRIPTION ========================
After the big success of TEI'07 we are now organizing TEI'08, the
second international conference dedicated to research in tangible
and embedded interaction. Work addressing HCI issues, design, use
context, tools and technologies, as well as interactive art works
are all welcome, including especially interdisciplinary
submissions across these themes. We anticipate that papers will
be published through the ACM Digital Library (confirmation will
follow soon).
With technological advances, computing has progressively moved
beyond the desktop into new physical and social contexts. As
physical artifacts gain new computational behaviors, they become
reprogrammable, customizable, repurposable, and interoperable in
rich ecologies and diverse contexts. They also become more
complex, and require intense design effort in order to be
functional, usable, and enjoyable. Designing such systems
requires interdisciplinary thinking. Their creation must not only
encompass software, electronics, and mechanics, but also the
system's physical form and behavior, its social and physical
milieu, and beyond.
Research on tangible and embedded interaction has gained
substantial visibility and activity over the past decade and it
has worn many names, including tangible interfaces, graspable
interfaces, physical computing, tangible interaction, IT product
design, appliance design, interactive spaces, etc.; and been
associated with larger research areas, including mixed, virtual,
and augmented reality, and ubiquitous and pervasive computing.
The conference brings together this new field, providing a
meeting ground for the diverse communities of research and
practice involved with tangibles -- from computing, hardware, and
sensor technology, to HCI, interaction design, and CSCW, to
product and industrial design and interactive arts. We invite
submissions from all of these perspectives, be they theoretical,
conceptual, technical, applied, or artistic. The conference is
designed to provide appropriate presentation forms for different
types of contributions including talks, interactive exhibits,
demos or performances, and posters. All submission types will be
included in the proceedings as papers and will be integrated
within the single-track conference. Interdisciplinary submissions
are particularly welcome.
=================== TOPICS FOR SUBMISSION ==============
Authors are invited to submit high-quality papers about original
research that contributes to advancing the field. Appropriate
topics include but are not limited to:
* Case studies and evaluations of working deployments
* Analysis of key challenges, proposals of research agenda
* Relation of tangible and embedded interaction to other paradigms
* Programming paradigms and tools, toolkits, software architectures
* Novel interactive uses of sensors+actuators,
electronics+mechatronics
* Design guidelines, methods, and processes
* Novel appl. areas, innovative solutions/systems and industrial apps
* Theoretical foundations, frameworks, and concepts
* Philosophical, ethical & social implications
* Interfaces specific in form and context to particular cultures
* Usability and enjoyment
* Advantages of these kinds of systems, weaknesses, affordances
* Learning from the role of physicality in everyday environments
* Embodied interaction, movement, and choreography of interaction
* Role of physicality for human perception, cognition and experience
* Teaching experiences, lessons learned, and best practices
* Standardization, production, and business applications
=================== SUBMISSION DETAILS =================
Papers must present original material and will be reviewed
rigorously by at least 3 reviewers in a double-blind process. So
please anonymize your submission. Papers in all areas will be
reviewed and assessed based on the contribution they make to the
field. Submission will be electronic and in ACM SIGCHI format.
Papers can vary in length, using the ACM SIGCHI format and have
either 8, 4, or 2 pages. All papers will undergo the same review
process and be published in the same way. Length must match the
contribution, and the general criteria hold for all papers.
Papers can be presented as talk, poster, exhibit or demo,
regardless of length. E.g. an exhibit of a novel design can be
published as an 8 page paper, while a talk on a novel sensor
technique might as a paper fit 2 pages - or vice versa. Authors
can indicate what kind of presentation they prefer or suits their
contribution.
In case of acceptance, at least one author must register before
the early registration deadline for the conference in order for
the final paper version to be published in the conference
proceedings.
The online submission website can be found from here:
http://www.tei-conf.org/submission.html
=================== STEERING COMMITTEE =================
Eva Hornecker Open University, UK
Caroline Hummels Eindhoven University of Technology, NL
Robert Jacob Tufts University, USA
Brygg Ullmer Louisiana State University, USA
=================== PROGRAM COMMITTEE ==================
Omar Abou Khaled, U. of Applied Sciences of Western Switzerland
Kristina Andersen, STEIM
Alissa Antle, Simon Fraser University
Steffi Beckhaus, University of Hamburg
Bert Bongers, UTS
Leah Buechley, University of Colorado
Ellen Do, Georgia Tech
Michael Evans, Virginia Tech
Frank Feltham, RMIT University
Alois Ferscha, University of Linz
Geraldine Fitzpatrick, University of Sussex
Morten Fjeld, Chalmers University of Technology
Mark Gross, Carnegie Mellon University
Tom Gross, Bauhaus-University Weimar
Jonna Hakkila, Nokia
Beverly Harrison, Intel Research
Ken Hinckley, Microsoft Research
Paul Holleis, Nokia Research Center
Eva Hornecker, The Open University
Giulio Jacucci, Helsinki Institute for Information Technology
Pamela Jennings, Carnegie Mellon University
Sergi Jorda, Universitat Pompeu Fabra
Boriana Koleva, U. Nottingham
Peter Krogh, Aarhus University
Denis Lalanne, University of Fribourg
Astrid Larssen, University of Technology Sydney
Christopher Lueg, University of Tasmania
Paul Marshall, The Open University
Rene Mayrhofer, U. Lancaster
Floyd Mueller, The University of Melbourne
Claire O’Malley, University of Nottingham
Trevor Pering, Intel Research
Marianne Petersen, University of Aarhus
Ivan Poupyrev, Sony CSL
Janet Read, University of Central Lancashire
Michael Rohs, Telekom Labs
Enrico Rukzio, U. Lancaster
Chris Schmandt, MIT Media Lab
Orit Shaer, Tufts University
Ehud Sharlin, University of Calgary
Beat Signer, ETH Zurich
Andrew Smith, Meraka Institute, South Africa
Tomas Sokoler, Malmoe University
Marcelle Stienstra, University of Southern Denmark
Bruce Thomas, University of South Australia
Kristof van Laerhoven, U. Darmstadt
Jean Vanderdonckt, Universite catholique de Louvain
Nicolas Villar, U. Lancaster
Ron Wakkary, Simon Fraser University
Xiangyu Wang, University of Sydney
Stephan Wensveen, TU Eindhoven
Andy Wilson, Microsoft Research
Peta Wyeth, University of Nottingham
=================== DATES AND DEADLINES ================
Paper submission deadline October 5, 2007
Author notification deadline November 23, 2007
Camera-ready copy deadline December 14, 2007
Early registration deadline December 21, 2007
Conference dates February 18-21, 2008, b-it, Bonn,
Germany
For more information take a look at: http://tei-conf.org.
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Subject:
[TEI08] 2nd CfP: Tangible and Embedded Interaction 2008
From:
Ali Mazalek <[log in to unmask]>
Date:
Mon, 17 Sep 2007 17:10:27 -0400
To:
[log in to unmask]
CC:
"Hoven, E.A.W.H. van den" <[log in to unmask]>, Ali Mazalek
<[log in to unmask]>
Dear moderator,
Could you please post this CFP for TEI08?
Thanks!
-- Elise van den Hoven & Ali Mazalek
**************** SECOND Call for Papers ****************
******** TANGIBLE AND EMBEDDED INTERACTION 2008 ********
18-21 February 2008, b-it, Bonn, Germany
http://tei-conf.org
**PROGRAM CHAIRS:**
Elise van den Hoven Eindhoven University of Technology, NL
Ali Mazalek Georgia Institute of Technology, USA
**CONFERENCE CHAIRS:**
Albrecht Schmidt University of Bonn, Germany
Hans Gellersen Lancaster University, UK
**DATES AND LOCATION:**
Full submissions will be due October 5, 2007
Papers can be submitted online:
http://www.tei-conf.org/submission.html
TEI08 will take place 18-21 February 2008 in Bonn, Germany
=================== DESCRIPTION ========================
After the big success of TEI'07 we are now organizing TEI'08, the
second international conference dedicated to research in tangible
and embedded interaction. Work addressing HCI issues, design, use
context, tools and technologies, as well as interactive art works
are all welcome, including especially interdisciplinary
submissions across these themes. We anticipate that papers will
be published through the ACM Digital Library (confirmation will
follow soon).
With technological advances, computing has progressively moved
beyond the desktop into new physical and social contexts. As
physical artifacts gain new computational behaviors, they become
reprogrammable, customizable, repurposable, and interoperable in
rich ecologies and diverse contexts. They also become more
complex, and require intense design effort in order to be
functional, usable, and enjoyable. Designing such systems
requires interdisciplinary thinking. Their creation must not only
encompass software, electronics, and mechanics, but also the
system's physical form and behavior, its social and physical
milieu, and beyond.
Research on tangible and embedded interaction has gained
substantial visibility and activity over the past decade and it
has worn many names, including tangible interfaces, graspable
interfaces, physical computing, tangible interaction, IT product
design, appliance design, interactive spaces, etc.; and been
associated with larger research areas, including mixed, virtual,
and augmented reality, and ubiquitous and pervasive computing.
The conference brings together this new field, providing a
meeting ground for the diverse communities of research and
practice involved with tangibles -- from computing, hardware, and
sensor technology, to HCI, interaction design, and CSCW, to
product and industrial design and interactive arts. We invite
submissions from all of these perspectives, be they theoretical,
conceptual, technical, applied, or artistic. The conference is
designed to provide appropriate presentation forms for different
types of contributions including talks, interactive exhibits,
demos or performances, and posters. All submission types will be
included in the proceedings as papers and will be integrated
within the single-track conference. Interdisciplinary submissions
are particularly welcome.
=================== TOPICS FOR SUBMISSION ==============
Authors are invited to submit high-quality papers about original
research that contributes to advancing the field. Appropriate
topics include but are not limited to:
* Case studies and evaluations of working deployments
* Analysis of key challenges, proposals of research agenda
* Relation of tangible and embedded interaction to other paradigms
* Programming paradigms and tools, toolkits, software architectures
* Novel interactive uses of sensors+actuators,
electronics+mechatronics
* Design guidelines, methods, and processes
* Novel appl. areas, innovative solutions/systems and industrial apps
* Theoretical foundations, frameworks, and concepts
* Philosophical, ethical & social implications
* Interfaces specific in form and context to particular cultures
* Usability and enjoyment
* Advantages of these kinds of systems, weaknesses, affordances
* Learning from the role of physicality in everyday environments
* Embodied interaction, movement, and choreography of interaction
* Role of physicality for human perception, cognition and experience
* Teaching experiences, lessons learned, and best practices
* Standardization, production, and business applications
=================== SUBMISSION DETAILS =================
Papers must present original material and will be reviewed
rigorously by at least 3 reviewers in a double-blind process. So
please anonymize your submission. Papers in all areas will be
reviewed and assessed based on the contribution they make to the
field. Submission will be electronic and in ACM SIGCHI format.
Papers can vary in length, using the ACM SIGCHI format and have
either 8, 4, or 2 pages. All papers will undergo the same review
process and be published in the same way. Length must match the
contribution, and the general criteria hold for all papers.
Papers can be presented as talk, poster, exhibit or demo,
regardless of length. E.g. an exhibit of a novel design can be
published as an 8 page paper, while a talk on a novel sensor
technique might as a paper fit 2 pages - or vice versa. Authors
can indicate what kind of presentation they prefer or suits their
contribution.
In case of acceptance, at least one author must register before
the early registration deadline for the conference in order for
the final paper version to be published in the conference
proceedings.
The online submission website can be found from here:
http://www.tei-conf.org/submission.html
=================== STEERING COMMITTEE =================
Eva Hornecker Open University, UK
Caroline Hummels Eindhoven University of Technology, NL
Robert Jacob Tufts University, USA
Brygg Ullmer Louisiana State University, USA
=================== PROGRAM COMMITTEE ==================
Omar Abou Khaled, U. of Applied Sciences of Western Switzerland
Kristina Andersen, STEIM
Alissa Antle, Simon Fraser University
Steffi Beckhaus, University of Hamburg
Bert Bongers, UTS
Leah Buechley, University of Colorado
Ellen Do, Georgia Tech
Michael Evans, Virginia Tech
Frank Feltham, RMIT University
Alois Ferscha, University of Linz
Geraldine Fitzpatrick, University of Sussex
Morten Fjeld, Chalmers University of Technology
Mark Gross, Carnegie Mellon University
Tom Gross, Bauhaus-University Weimar
Jonna Hakkila, Nokia
Beverly Harrison, Intel Research
Ken Hinckley, Microsoft Research
Paul Holleis, Nokia Research Center
Eva Hornecker, The Open University
Giulio Jacucci, Helsinki Institute for Information Technology
Pamela Jennings, Carnegie Mellon University
Sergi Jorda, Universitat Pompeu Fabra
Boriana Koleva, U. Nottingham
Peter Krogh, Aarhus University
Denis Lalanne, University of Fribourg
Astrid Larssen, University of Technology Sydney
Christopher Lueg, University of Tasmania
Paul Marshall, The Open University
Rene Mayrhofer, U. Lancaster
Floyd Mueller, The University of Melbourne
Claire O’Malley, University of Nottingham
Trevor Pering, Intel Research
Marianne Petersen, University of Aarhus
Ivan Poupyrev, Sony CSL
Janet Read, University of Central Lancashire
Michael Rohs, Telekom Labs
Enrico Rukzio, U. Lancaster
Chris Schmandt, MIT Media Lab
Orit Shaer, Tufts University
Ehud Sharlin, University of Calgary
Beat Signer, ETH Zurich
Andrew Smith, Meraka Institute, South Africa
Tomas Sokoler, Malmoe University
Marcelle Stienstra, University of Southern Denmark
Bruce Thomas, University of South Australia
Kristof van Laerhoven, U. Darmstadt
Jean Vanderdonckt, Universite catholique de Louvain
Nicolas Villar, U. Lancaster
Ron Wakkary, Simon Fraser University
Xiangyu Wang, University of Sydney
Stephan Wensveen, TU Eindhoven
Andy Wilson, Microsoft Research
Peta Wyeth, University of Nottingham
=================== DATES AND DEADLINES ================
Paper submission deadline October 5, 2007
Author notification deadline November 23, 2007
Camera-ready copy deadline December 14, 2007
Early registration deadline December 21, 2007
Conference dates February 18-21, 2008, b-it, Bonn,
Germany
For more information take a look at: http://tei-conf.org.
---------------------------------------------------------------
To unsubscribe, send an empty email to
mailto:[log in to unmask]
For further details of CHI lists see http://sigchi.org/listserv
---------------------------------------------------------------
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