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From:
Alireza Sahami <[log in to unmask]>
Reply To:
Alireza Sahami <[log in to unmask]>
Date:
Wed, 26 Oct 2011 05:05:59 +0000
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                               CALL FOR PAPERS



                     PerCom 2012 - Work In Progress

IEEE International Conference on Pervasive Computing and Communications

                       http://www.percom.org



                         Lugano, Switzerland

                         March 19 - 23, 2012



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The Work-in-Progress (WiP) session, included in PerCom for the seventh year,

gives its participants an opportunity to present and discuss early and

emerging results and bring about novel research questions, approaches, and

directions. The specific aim of the WiP session is to provide a forum for

timely presentation, discussion and feedback for novel, controversial, and

thought provoking ideas. All selected papers will be presented as posters in

a special conference session following a 1-min madness oral presentation.

In addition, all selected papers will be included in PerCom Workshops

proceedings to be published by IEEE and included in the digital library.



Contributions are solicited in all areas of pervasive computing research and

applications. Papers are expected to report on early or ongoing research on

any aspect of pervasive computing and communications. Novel approaches and

results are especially appreciated such as ongoing experimentation.



TOPICS:

Topics of interest include, but are not limited to:



  - Innovative pervasive computing applications

  - Software engineering aspects of pervasive computing

  - Middleware services and agent technologies

  - Pervasive computing for smart environments

  - Energy-efficient and green pervasive computing

  - Wearable systems

  - Enabling technologies for pervasive systems (e.g., wireless BAN, PAN)

  - Multimodal sensing and data fusion for pervasive applications

  - Mobile phone sensing applications

  - Communication architectures for pervasive computing

  - Ad hoc networks for pervasive communications

  - Sensors and RFID in pervasive systems

  - Pervasive opportunistic communications and applications

  - Pervasive sensing, perception and semantic interpretation

  - Mobile peer-to-peer and distributed systems for pervasive computing

  - Adaptive, autonomic and context-aware computing

  - Positioning and tracking technologies

  - Virtual and immersive systems for pervasive environments

  - Social and economics aspects of pervasive computing





SUBMISSION GUIDELINES:

Authors are requested to submit original, unpublished manuscripts in standard

IEEE proceedings format (two-column format with a 4-page limit including

figures, tables, and references) in PDF format that include contact

information of all the authors to the EDAS submission site.  If you

have any questions, please send an email to the WIP chairs at

[log in to unmask] .  The submitted manuscripts will be reviewed by the

WiP Program Committee. The authors of accepted papers will present their work

during the main conference in a special WiP poster session and must register

for the conference. The papers of the WiP session will be published in the

workshop proceedings of the Tenth Annual IEEE International Conference on

Pervasive Computing and Communications.



Poster Size: The minimum is 20" x 30" (508 mm x 763 mm) up to about 25% more

in each dimension.



IMPORTANT DATES:

Paper submissions: November 7, 2011, 11:59pm PDT

Notification of acceptance: January 7, 2012

Camera-ready copy due: January 27, 2012

Conference date: March 19 - 23, 2012



TECHNICAL PROGRAM COMMITTEE:

Chatschik Bisdikian, IBM T. J. Watson Research Center, USA

Sathish Gopalakrishnan, University of British Columbia, Canada

Zhu Li, Huawei Corp., USA

Emiliano Miluzzo, AT&T, USA

Mirco Musolesi, University of Birmingham, UK

Daniela Nicklas, Carl von Ossietzky Universitat Oldenburg, Germany

Gregor Schiele, University of Mannheim, Germany



IEEE PerCom 2012 WiP Co-Chairs:

Franca Delmastro, IIT-CNR, Italy

Qi Han, Colorado School of Mines, USA

Xun Luo, Qualcomm, USA






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