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Mon, 21 Jan 2019 14:37:32 +0100
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TSP 2019 <[log in to unmask]>
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Selected high-quality papers will be invited for publication in 
/*Special Issue Selected Papers from the 2019 42nd Int. Conf. on 
Telecommunications and Signal Processing (TSP)*/ in /*Applied Sciences*/ 
journal (WoS IF: 1.689) - 
*https://www.mdpi.com/journal/applsci/special_issues/tsp2019*

*** *Special Session on Signal Processing and Classification for 
Building Intelligent Recognition Systems* co-located with /2019 42nd 
International Conference on Telecommunications and Signal Processing 
(TSP)/   ***
July 1-3, 2019, Budapest, Hungary
Web: http://tsp.vutbr.cz/

Full Paper Submission: February 15, 2019

************************************************************************************
*Technical co-sponsors:* IEEE Region 8 (Europe, Middle East and 
Africa)*, IEEE Hungary Section**, IEEE Czechoslovakia Section**, and 
IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter** [* pending 
approval; ** approved].

The *TSP 2019 Proceedings*, containing presented papers at the 
Conference, will be submitted for indexing to the *IEEE Xplore® Digital 
Library**, *SCOPUS*, *Conference Proceedings Citation Index (CPCI) of 
Thomson Reuters*, *DBLP*, and *Google Scholar* databases.
************************************************************************************

Dear Colleague,

Intelligent systems and artificial intelligence are research areas that 
started to have an important impact on our everyday life, with 
implications in a wide range of domains (e.g., Speech Recognition, 
Brain-Machine Interface, Autonomous Robots, Smart Healthcare, Ambient 
Intelligence, Geoscience and Remote Sensing). Intelligent recognition 
systems require adequate and powerful tools in terms of signal 
processing, data analytics and decision making. Moreover, building 
intelligent systems comes at the cost of providing efficient solutions 
for facing real-world societal and security issues concerning their 
usage. Under the framework of 2019 42nd International Conference on 
Telecommunications and Signal Processing (TSP) held during July 1-3, 
2019 in Budapest, Hungary, the aim of this special session is to foster 
the use of machine learning and knowledge discovery tools among the 
signal processing community, to bridge the gap between researchers from 
academia and industry professionals activating in AI-related fields and 
identify possible collaborations. This special session will provide a 
forum of discussion on the recent advances and development experiences, 
with the goal of creating a synergy between signal processing and 
pattern recognition domains. Topics include but are not limited to:

- Pattern Recognition
- Neural Networks
- Data Mining
- Computational Intelligence
- Information Retrieval
- Knowledge Discovery
- Big Data
- Dimensionality Reduction
- Data Visualization and Communication
- Security

For more details please visit the Conference website at 
http://tsp.vutbr.cz/?page_id=2744#SS3-19 .

/_EDITORIAL BOARD:_/

- Prof. Dr. Corneliu Burileanu — University Politehnica of Bucharest, 
Romania (E-mail: [log in to unmask])
- As. Prof. Dr. Anamaria Radoi — University Politehnica of Bucharest, 
Romania (E-mail: [log in to unmask])

/_STUDENT BEST PAPER AWARD:_/

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.

/_ORGANIZERS: _/

The TSP 2019 will be *IEEE technically co-sponsored Conference organized 
in cooperation with eighteen universities:

- Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
- Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
- Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
Croatia
- Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology in Bratislava, Institute of 
Telecommunications, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, 
Bulgaria
- Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de 
Saint-Denis (LIASD), France
- University “Politehnica” of Bucharest, Center for Advanced Research on 
New Materials, Products and Innovative Processes (“CAMPUS”)
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
Slovenia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

/_IMPORTANT DATES:_/

Full Paper Submission: February 15, 2019
Notification of Paper Acceptance: April 15, 2019
Final Paper Submission: April 30, 2019
Authors' Late Registration and Payment: May 20, 2019
Listeners' Registration: July 3, 2019
Conference: July 1-3, 2019

/_CONTACTS: _/

For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to [log in to unmask] .

Looking forward to meeting you in Budapest, Hungary.

With best regards,

Norbert Herencsar and Attila Vidacs
TSP 2019 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: [log in to unmask]

Follow us on:
  - Facebook https://www.facebook.com/tspconf/
  - Twitter https://twitter.com/tspconf/
===================================================
doc. Ing. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

&

Assoc. Prof. Attila Vidacs, Ph.D.
Department of Telecommunications and Media Informatics
Faculty of Electrical Engineering and Informatics
Budapest University of Technology and Economics
Magyar tudosok korutja 2.
1117 Budapest
Hungary

************************************************************************************
TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in *IEEE Xplore® and other 
databases) if the paper is not presented at the Conference.
************************************************************************************


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