CHI-ANNOUNCEMENTS Archives

ACM SIGCHI General Interest Announcements (Mailing List)

CHI-ANNOUNCEMENTS@LISTSERV.ACM.ORG

Options: Use Forum View

Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
IEEE Technically Co-Sponsored TSP 2018 <[log in to unmask]>
Reply To:
IEEE Technically Co-Sponsored TSP 2018 <[log in to unmask]>
Date:
Tue, 6 Feb 2018 15:23:27 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (183 lines)
***   Special Session on Robust Face and Emotion Recognition and 
Analysis   ***
*** http://tsp.vutbr.cz/documents/TSP2018_CfP_SS5_v1.pdf        ***


2018 41st International Conference on Telecommunications and Signal 
Processing (TSP)
July 4-6, 2018, Athens, Greece
Web: http://tsp.vutbr.cz/

Full Paper Submission: February 15, 2018

************************************************************************************
Technically co-sponsored by IEEE Region 8 (Europe, Middle East and 
Africa), IEEE Greece Section, IEEE Czechoslovakia Section, and IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter.

The TSP 2018 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the IEEE Xplore® Digital Library 
registered under IEEE Conference Record #43564, SCOPUS, Conference 
Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google 
Scholar databases.

Authors of the best rated and presented papers will be invited for 
publishing in special issues of international journals.
************************************************************************************

Dear Colleague,

Image and face recognition is fast becoming a familiar feature in apps 
and on websites, potentially making life easier for all of us. Many 
applications and fields are targeted by robust recognition such as 
security, access control, social media, etc. Conventional techniques are 
improved or combined with intelligent tools to overcome constraints of 
face position, hidden or environment conditions related to luminosity, 
noise and other. As an extension to this field, emotion recognition and 
analysis has been extensively researched in neuroscience, psychology, 
cognitive science and computer science. Combined with face recognition, 
these two fields become necessary for many new industrial and 
applications. Within the framework of the 2018 41st International 
Conference on Telecommunications and Signal Processing (TSP) held during 
July 4-6, 2018 in Athens, Greece, we invite you to present and discuss 
advances in the research and development face recognition and emotion 
detection. Topics of interest include, but are not limited to, the 
following:

- Face identification and recognition
- Biometrics & Authentication
- Video tracking
- Robust identification of hidden and truncated faces
- Bio-medical & Cognitive Science
- Human Action Analysis
- Gesture recognition
- Perception, Cognition and Psychophysiology of Gesture Interaction
- Kinect-based Kinematic Data Analysis and Evaluation for Clinical 
Applications
- Generalized Face Spoofing Detection in Real-World Applications
- Automatic Kinship Verification from Face
- Emotion identifying and classification

For more details please visit the Conference website at 
http://tsp.vutbr.cz/?page_id=3754#SS5-18 .

EDITORIAL BOARD:

- Ing. Dr. HDR. Hassene seddik — ENSIT, Tunisia (E-mail: 
[log in to unmask])
- Dr. Zied Lachiri — ENIT, Tunisia
- Assoc. Prof. Nawres Khlifa — ISTMT, Tunisia

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 3 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Certificate of Appreciation Plaque and 
an IEEE Student or IEEE Graduate Student membership for 2019.

ORGANIZERS:

The TSP 2018 is IEEE technically co-sponsored Conference organized in 
cooperation with seventeen universities:

- Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
- Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
- Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology, Institute of Telecommunications, 
Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, 
Bulgaria
- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de 
Saint-Denis (LIASD), France
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
Slovenia
- University of Osijek, Faculty of Electrical Engineering, Computer 
Science and Information Technology Osijek, Osijek, Croatia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

IMPORTANT DATES:

Full Paper Submission: February 15, 2018
Notification of Paper Acceptance: April 15, 2018
Final Paper Submission: April 30, 2018
Authors' Early Registration and Payment: May 10, 2018
Authors' Late Registration and Payment: May 20, 2018
Listeners' Registration: July 4, 2018
Conference: July 4-6, 2018

CONTACTS:

For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to [log in to unmask]

Looking forward to meeting you in Athens, Greece.

With best regards,

Norbert Herencsar and Costas Psychalinos
TSP 2018 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: [log in to unmask]

Follow us on:
  - Facebook https://www.facebook.com/tspconf/
  - Twitter https://twitter.com/tspconf/
===================================================
doc. Ing. Norbert Herencsar, Ph.D., IEEE Senior Member - IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter Chair
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

&

Prof. Dr. Costas Psychalinos, IEEE Senior Member
Physics Department
University of Patras
26504 Rio Patras
Greece

************************************************************************************
TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference. However, 
this paper will be distributed as part of the Conference proceedings 
issued on an USB drive.
************************************************************************************

    ---------------------------------------------------------------
    For news of CHI books, courses & software, join CHI-RESOURCES
     mailto: [log in to unmask]

    To unsubscribe from CHI-ANNOUNCEMENTS send an email to
     mailto:[log in to unmask]

    For further details of CHI lists see http://listserv.acm.org
    ---------------------------------------------------------------

ATOM RSS1 RSS2