ACM SIGCHI General Interest Announcements (Mailing List)


Options: Use Forum View

Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
秦董洪 <[log in to unmask]>
Reply To:
秦董洪 <[log in to unmask]>
Tue, 26 Feb 2019 21:55:24 +0800
text/plain (266 lines)
15th International Conference on
Information Security Practice and Experience (ISPEC 2019)

Kuala Lumpur, Malaysia
November 26-28, 2019

Call for Papers – ISPEC 2019

The 15th International Conference on Information Security Practice and Experience (ISPEC 2019) will be held in Kuala Lumpur, Malaysia on November 26-28, 2019. The conference will be organised by Universiti Tunku Abdul Rahman (UTAR).  The main goal of the conference is to promote research on new information security technologies, including their applications and their integration with IT systems in various vertical sectors. Previous ISPEC has taken place in Singapore (2005), Hangzhou, China (2006), Hong Kong, China (2007), Sydney, Australia (2008), Xi'an, China (2009), Seoul, Korea (2010), Guangzhou, China (2011), Hangzhou, China (2012), Lanzhou, China (2013), Fuzhou, China (2014), Beijing, China (2015), Zhangjiajie, China (2016), Melbourne, Australia (2017) and Tokyo, Japan (2018). For all sessions, the conference proceedings were published by Springer in the Lecture Notes in Computer Science series.

Areas of interest for ISPEC 2019 include, but are not limited to:

Applied cryptography
Mobile security
Cloud security
Access control
Privacy enhanced technology
Viruses and malware
Software security
Database security
Web security
Operating system security
Intrusion detection
Big data security and privacy
Biometric Security
Network security
Key management
Security and privacy in ubiquitous computing
Formal methods for security
Digital forensics
Security for critical infrastructures
Embedded systems security
Lightweight security
Smart grid security
Cyber security for urban transportation
Cyber-physical security


Important Dates:

Submission Deadline:        8 June 2019 (15:59 UTC)

Acceptance Notification:    29 July 2019

Camera-ready Copy Due:  3 September 2019

Conference:                 26-28 November 2019


Instructions for Authors: Authors are invited to submit original papers. Submissions must not substantially duplicate work that any of the authors has published elsewhere or has submitted in parallel for consideration of any other conference with proceeding or any journal. The submission must be anonymous, with no author names, affiliations, acknowledgements, or obvious references. Original contributions are invited up to 16 pages in length (single column) excluding the bibliography and appendices and up to 20 pages in total, using at least 11-point fonts and with reasonable margins. Submissions not meeting the submission guidelines risk rejection without consideration of their merits. Authors of accepted papers must guarantee that at least one of the authors will register and attend the conference to present their work. Submitted papers should follow the formatting instructions of the Springer LNCS Style. Please kindly refer to Springer LNCS Author Information for style and formatting guidelines.

Conference Proceedings: The conference proceedings will be published by Springer-Verlag in the Lecture Notes in Computer Science series.

Journal Special Issues: Selected papers presented at the ISPEC 2019 will be invited to consider submission (after significant extension) for special issues in the following journals: (TBC)


Honored Chair

Bok-Min Goi, Universiti Tunku Abdul Rahman, Malaysia


General Chair

Wun-She Yap, Universiti Tunku Abdul Rahman, Malaysia


Organization Committee

Local Chair: Denis C.K. Wong, Universiti Tunku Abdul Rahman, Malaysia

Finance Chair: Yee-Kai Tee, Universiti Tunku Abdul Rahman, Malaysia

Sponsorship Chair: Wai-Kong Lee, Universiti Tunku Abdul Rahman, Malaysia

Web Chair: Ji-Jian Chin, Multimedia University, Malaysia

Publicity Co-Chairs:

Weizhi Meng, Technical University of Denmark, Denmark

Donghong Qin, Guangxi University for Nationalities, China

Shifeng Sun, Monash University, Australia

Program Co-Chairs

Swee-Huay Heng, Multimedia University, Malaysia

Javier Lopez, University of Malaga, Spain

Program Committee:

Man Ho Au, The Hong Kong Polytechnic University, Hong Kong

Joonsang Baek, University of Wollongong, Australia

Aniello Castiglione, University of Salerno, Italy

David Chadwick, University of Kent, UK

Jiageng Chen, Central China Normal University, China

Xiaofeng Chen, Xidian University, China

Kim-Kwang Raymond Choo, The University of Texas at San Antonio, USA

Sherman S. M. Chow, The Chinese University of Hong Kong, Hong Kong

JosepDomingo-Ferrer, Universitat Rovira i Virgili, Spain

Jose Maria de Fuentes, Universidad Carlos III de Madrid, Spain

Carmen Fernández-Gago,University of Malaga, Spain

José M. Fernandez, Ecole Polytechnique de Montreal, Canada

Dieter Gollmann, Hamburg University of Technology, Germany

Dimitris Gritzalis, Athens University of Economics and Business, Greece

Stefanos Gritzalis, University of the Aegean, Greece

Gerhard Hancke, City University of Hong Kong, Hong Kong

Debiao He, Wuhan University, China 

Shoichi Hirose, University of Fukui, Japan

Xinyi Huang, Fujian Normal University, China

Julian Jang-Jaccard, Massey University, Nеw Zеаlаnd

Hiroaki Kikuchi, Meiji University, Japan

Kwangjo Kim, Korea Advanced Institute of Science and Technology, Korea

Noboru Kunihiro, The University of Tokyo, Japan

Miroslaw Kutylowski, Wroclaw University of Technology, Poland

Costas Lambrinoudakis, University of Piraeus, Greece

Albert Levi, Sabanci University, Turkey

Shujun Li, University of Kent, UK

Tieyan Li, Huawei International Pte Ltd, Singapore

Yingjiu Li, Singapore Management University, Singapore

Kaitai  Liang, University of Surrey, UK

Joseph Liu, Monash University, Australia

Zhe Liu, Nanjing University of Aeronautics and Astronautics, China

Giovanni Livraga, University of Milan, Italy

Jiqiang Lu, Beihang University, China

Rongxing Lu, University of New Brunswick, Canada

Tzu-Chuen Lu, Chaoyang University of Technology, Taiwan

Di Ma, University of Michigan, USA

Weizhi Meng, Technical University of Denmark, Denmark

Chris Mitchell, Royal Holloway, University of London, UK

David Naccache, École Normale Supérieure, France

Takeshi Okamoto, Tsukuba University of Technology, Japan

Kazumasa Omote, University of Tsukuba, Japan

Pedro Peris-Lopez, Carlos III University of Madrid, Spain

Günther Pernul, Universität Regensburg, Germany

Raphael C.-W. Phan, Multimedia University, Malaysia

Josef Pieprzyk, Queensland University of Technology, Australia

Geong Sen Poh, National University of Singapore, Singapore 

C. Pandu Rangan, Indian Institute of Technology, Madras, India

Indrajit Ray, Colorado State University, USA

Na Ruan, Shanghai Jiaotong University, China

Sushmita Ruj, Indian Statistical Institute, India

Pierangela Samarati, University of Milan, Italy

Jun Shao, Zhejiang Gongshang University, China

Miguel     Soriano, Universitat Politècnica de Catalunya, Spain

Chunhua Su, University of Aizu, Japan

Willy Susilo, University of Wollongong, Australia

Syh-Yuan Tan, Newcastle University, UK

Qiang Tang, New Jersey Institute of Technology, USA

Cong Wang, City University of Hong Kong, Hong Kong

Ding Wang, Peking University, China

Guilin  Wang, Huawei International Pte Ltd, Singapore

Qianhong Wu, Beihang University, China

Shouhuai Xu, University of Texas at San Antonio, USA

Toshihiro Yamauchi, Okayama University, Japan

Wei-Chuen Yau, Xiamen University Malaysia, Malaysia

Kuo-Hui Yeh, National Dong Hwa University, Taiwan

Xun Yi, RMIT University, Australia

Yong Yu, Shaanxi Normal University, China

Tsz Hon Yuen, The University of Hong Kong, Hong Kong

Yuexin Zhang, Swinburne University of Technology, Australia

Jianying  Zhou, Singapore University of Technology and Design, Singapore 

Sencun Zhu, The Pennsylvania State University, USA

    For news of CHI books, courses & software, join CHI-RESOURCES
     mailto: [log in to unmask]

    To unsubscribe from CHI-ANNOUNCEMENTS send an email to
     mailto:[log in to unmask]

    For further details of CHI lists see