CHI-ANNOUNCEMENTS Archives

ACM SIGCHI General Interest Announcements (Mailing List)

CHI-ANNOUNCEMENTS@LISTSERV.ACM.ORG

Options: Use Forum View

Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"IEEE R8 Tech. Co-Sponsored TSP 2019" <[log in to unmask]>
Reply To:
IEEE R8 Tech. Co-Sponsored TSP 2019
Date:
Tue, 26 Mar 2019 07:02:38 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (243 lines)
[ We apologize if you receive multiple copies of this email. Please 
distribute this CfP to your colleagues. ]
***************************************************************************

2019 42nd International Conference on Telecommunications and Signal 
Processing (TSP)
July 1-3, 2019, Budapest, Hungary
Web: http://tsp.vutbr.cz/

Late Breaking News Paper Submission: April 5, 2019 - 3PM CET (hard deadline)

***************************************************************************
Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), 
IEEE Hungary Section, IEEE Czechoslovakia Section, and IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter.

The TSP 2019 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the IEEE Xplore® Digital Library - 
IEEE Conference Record #46676, SCOPUS, Conference Proceedings Citation 
Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, authors of about 25% highest rated papers will 
also be invited to submit the extended version for publishing in Special 
Journal Issues (papers to be published after significant extension and 
new review process):
•    Special Issue Selected Papers from the 2019 42nd International 
Conference on Telecommunications and Signal Processing (TSP) of an 
Applied Sciences (ISSN 2076-3417), an international peer-reviewed open 
access journal on all aspects of applied natural sciences published by 
MDPI and indexed by Web of Science (2017 JCR Q3; current Impact Factor: 
1.689)
•    International Journal of Advances in Telecommunications, 
Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed 
by Google Scholar, CrossRef, WorldCat, EZB Elektronischen 
Zeitschriftenbibliothek, and Directory of Open Access Journals
•    Selected high-quality papers submitted to Workshop WS1 will be 
invited for publication in Special Issue “Recent Advances in Biometrics 
and its Applications” in Electronics journal (ISSN 2079-9292), published 
by MDPI and indexed by Web of Science (2017 JCR Q2; Impact Factor: 2.110)
***************************************************************************

Dear Colleague,

The 2019 42nd International Conference on Telecommunications and Signal 
Processing (TSP - http://tsp.vutbr.cz/), which will be held on July 1-3, 
2019, in Budapest, Hungary, has opened Call for Late Breaking News Paper 
Submissions with deadline April 5, 2019 - 3PM CET. Prospective authors 
are invited to submit a full papers (3 to 4 pages in two-column TSP 
template) describing original work. Late Breaking News is a venue for 
fast dissemination of novel and high-profile results for which 
timeliness of disclosure with the community is critical.

All the papers submitted to Late Breaking News Track and accepted to 
conference will be published in the conference proceedings issued 
online, which (containing only presented papers at the conference) will 
be submitted for indexing to the IEEE Xplore® Digital Library – IEEE 
Conference Record #46676, Conference Proceedings Citation Index (CPCI) 
of Thomson Reuters (formerly ISI Proceedings), SCOPUS, DBLP, and Google 
Scholar databases.

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.

ORGANIZERS:

The TSP 2019 is IEEE technically co-sponsored Conference organized in 
cooperation with eighteen universities:
•    Brno University of Technology, Department of Telecommunications, 
Brno, Czech Republic
•    Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
•    Czech Technical University in Prague, Department of 
Telecommunication Engineering, Prague, Czech Republic
•    Isik University, Department of Electrical and Electronics 
Engineering, Sile/Istanbul, Turkey
•    Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
•    Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
Croatia
•    Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
•    National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
•    Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
•    Slovak University of Technology in Bratislava, Institute of 
Multimedia Information and Communication Technologies, Bratislava, 
Slovak Republic
•    Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
•    Technical University of Sofia, Faculty of Telecommunications, 
Sofia, Bulgaria
•    Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée 
de Saint-Denis (LIASD), France
•    University “Politehnica” of Bucharest, Center for Advanced Research 
on New Materials, Products and Innovative Processes (“CAMPUS”)
•    University of Ljubljana, Laboratory for Telecommunications, 
Ljubljana, Slovenia
•    University of Patras, Physics Department, Patras, Greece
•    VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
•    West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

COMMITTEES:

•    Miloslav Filka, Brno University of Technology, Czech Republic – 
Full Professor, TSP Conference Founder - Honorary Chair
•    Norbert Herencsar, Brno University of Technology, Czech Republic – 
IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior 
Member - General Co-Chair
•    Attila Vidacs, Budapest University of Technology and Economics, 
Hungary – Deputy Head of Department - General Co-Chair
•    Jiri Hosek, Brno University of Technology, Czech Republic – IEEE 
Member - Publications & Student Paper Contest Chair
•    Aslihan Kartci, Brno University of Technology, Czech Republic – 
IEEE Graduate Student Member - Publicity & Social Media Chair
•    Nandor Matrai, Asszisztencia Congress Bureau, Hungary – Finance Chair
•    Csilla Fulop, Asszisztencia Congress Bureau, Hungary – 
Registrations Chair

Steering Committee:

•    Larbi Boubchir, Universite Paris 8, France – Associate Professor, 
IEEE Senior Member
•    Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataro, 
Tecnocampus, Spain – Full Professor, Dean
•    Izzet Cem Goknar, Isik University, Turkey – Institute of Science 
Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full 
Professor, IEEE Life Fellow
•    Ray-Guang Cheng, National Taiwan University of Science and 
Technology (NTUST), Taiwan – Full Professor, IEEE Senior Member
•    Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor
•    Jaroslav Koton, Brno University of Technology, Czech Republic – 
Vice-dean for Research, IEEE Senior Member
•    Sridhar Krishnan, Ryerson University, Canada – Full Professor & 
Associate Dean, IEEE Senior Member
•    Mario Kusek, University of Zagreb, Croatia – IEEE Croatia Section 
Communications Chapter Chair, IEEE Member
•    Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice 
Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE 
Senior Member
•    Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE 
Senior Member
•    Jiri Misurec, Brno University of Technology, Czech Republic – Full 
Professor, Department Chair
•    Ram M. Narayanan, The Pennsylvania State University, USA – Full 
Professor, IEEE Fellow
•    Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE 
Senior Member
•    Serdar Ozoguz, Istanbul Technical University, Turkey – Full 
Professor, Associate Chair
•    Jakub Peksinski, West Pomeranian University of Technology, Poland
•    Hector Perez-Meana, National Polytechnic Institute, Mexico – Full 
Professor, IEEE Senior Member
•    Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full 
Professor, Dean, IEEE Senior Member
•    Costas Psychalinos, University of Patras, Greece – Full Professor, 
IEEE Senior Member
•    Markus Rupp, Vienna University of Technology, Austria – Full 
Professor, Dean, IEEE Fellow
•    Zdenek Smekal, Brno University of Technology, Czech Republic – Full 
Professor, IEEE Senior Member
•    Attila Vidacs, Budapest University of Technology and Economics, 
Hungary – Deputy Head of Department
•    Miroslav Voznak, VSB-Technical University of Ostrava, Czech 
Republic – Full Professor, Department Chair, IEEE Senior Member
•    Drago Zagar, Josip Juraj Strossmayer University of Osijek, Croatia 
– Full Professor, Dean, IEEE Senior Member

IMPORTANT DATES:

Workshop and Special Session Proposals: February 15, 2019 (extended 
deadline)
Full Paper Submission: March 18, 2019 - 6PM CET (hard deadline)
Late Breaking News Paper Submission: April 5, 2019 - 3PM CET (hard deadline)
Notification of Paper Acceptance: April 15, 2019
Final Paper Submission: April 30, 2019
Authors' Early Registration and Payment: May 10, 2019
Authors' Late Registration and Payment: May 20, 2019
Listeners' Registration: July 1, 2019
Conference: July 1-3, 2019

CONTACTS:

For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to [log in to unmask] .

Looking forward to meeting you in Budapest, Hungary.

With best regards,

Norbert Herencsar and Attila Vidacs
TSP 2019 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: [log in to unmask]

Follow us on:
  - Facebook https://www.facebook.com/tspconf/
  - Twitter https://twitter.com/tspconf/
===================================================
doc. Ing. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

&

Assoc. Prof. Attila Vidacs, Ph.D.
Department of Telecommunications and Media Informatics
Faculty of Electrical Engineering and Informatics
Budapest University of Technology and Economics
Magyar tudosok korutja 2.
1117 Budapest
Hungary

***************************************************************************
TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference.
***************************************************************************

    ---------------------------------------------------------------
    For news of CHI books, courses & software, join CHI-RESOURCES
     mailto: [log in to unmask]

    To unsubscribe from CHI-ANNOUNCEMENTS send an email to
     mailto:[log in to unmask]

    For further details of CHI lists see http://listserv.acm.org
    ---------------------------------------------------------------

ATOM RSS1 RSS2