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"ACM SIGCHI General Interest Announcements (Mailing List)" <[log in to unmask]>
Thu, 14 Feb 2019 15:39:36 +0100
"IEEE R8 Tech. Co-Sponsored TSP 2019" <[log in to unmask]>
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"IEEE R8 Tech. Co-Sponsored TSP 2019" <[log in to unmask]>
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[ We apologize if you receive multiple copies of this email. Please 
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2019 42nd International Conference on Telecommunications and Signal 
Processing (TSP)
July 1-3, 2019, Budapest, Hungary

Workshop and Special Session Proposals: February 15, 2019
Full Paper Submission: March 8, 2019 (extended deadline)

Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), 
IEEE Hungary Section, IEEE Czechoslovakia Section, and IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter.

The TSP 2019 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the IEEE Xplore® Digital Library - 
IEEE Conference Record #46676, SCOPUS, Conference Proceedings Citation 
Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, authors of about 25% highest rated papers will 
also be invited to submit the extended version for publishing in Special 
Journal Issues (papers to be published after significant extension and 
new review process):

  * Special Issue Selected Papers from the 2019 42nd International
    Conference on Telecommunications and Signal Processing (TSP) of an
    Applied Sciences (ISSN 2076-3417), an international peer-reviewed
    open access journal on all aspects of applied natural sciences
    published by MDPI and indexed by Web of Science (2017 JCR Q3;
    current Impact Factor: 1.689)
  * International Journal of Advances in Telecommunications,
    Electrotechnics, Signals and Systems (IJATES)(ISSN 1805-5443),
    indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen
    Zeitschriftenbibliothek, and Directory of Open Access Journals
  * Selected high-quality papers submitted to Workshop WS1 will be
    invited for publication in Special Issue “Recent Advances in
    Biometrics and its Applications” in Electronics journal (ISSN
    2079-9292), published by MDPI and indexed by Web of Science (2017
    JCR Q2; Impact Factor: 2.110)


Dear Colleague,

You are kindly invited to participate in the 2019 42nd International 
Conference on Telecommunications and Signal Processing (TSP -, which will be held on July 1-3, 2019, inBudapest, 
Hungary. The TSP Conference serves as a premier annual international 
forum to promote the exchange of the latest advances in 
telecommunication technology and signal processing. The aim of the 
Conference is to bring together both novice and experienced scientists, 
developers, and specialists, to meet new colleagues, collect new ideas, 
and establish new cooperation between research groups from universities, 
research centers, and private sectors from the whole Europe, America, 
Asia, Australia, and Africa.


TSP 2019 has opened Call for Papers for Full Paper Submissions with an 
EXTENDED deadline set for March 8, 2019 (21 extra days). We look forward 
to your innovative contributions in any of the following areas:

AREA 1: Telecommunications

   1. Information Systems
   2. Network Services
   3. Network Technologies
   4. Telecommunication Systems
   5. Modelling, Simulation and Measurement

AREA 2: Signal Processing

   6. Analog Signal Processing
   7. Audio, Speech and Language Processing
   8. Biomedical Signal Processing
   9. Digital Signal Processing
   10. Image and Video Signal Processing

For more details please visit the Conference website at .


Prospective Organizers are invited to submit proposals for Workshops and 
Special Sessions held during the TSP 2019 Conference. The following 
Workshop and Special Sessions were approved so far:

  * WS1: 3rd International Workshop on Recent Advances in Biometrics and
    its Applicationsby Assoc. Prof. Dr. Larbi Boubchir and Prof.
    Boubaker Daachi (both with the LIASD – University of Paris 8,
    France). Selected high-quality papers submitted to this workshop
    will be invited for publication in Special Issue “Recent Advances in
    Biometrics and its Applications” in Electronics journal (SJR Q1, IF:
  * SS1: Special Session on Internet of Things Communication Networksby
    Dr. Jorge Crichigno (University of South Carolina, U.S.A.) and Dr.
    Gautam Srivastava (Brandon University, Canada)
  * SS2: Special Session on Photonic Fibre Networks and their
    Applications (Theory, Design, Modeling, Operation, Trials)by Dr.
    Josef Vojtech (CESNET a.l.e., Czech Republic) and Dr. Tomas Horvath
    (Brno University of Technology, Czech Republic)
  * SS3: Special Session on Signal Processing and Classification for
    Building Intelligent Recognition Systemsby Prof. Dr. Corneliu
    Burileanu and As. Prof. Dr. Anamaria Radoi (both with the University
    Politehnica of Bucharest, Romania)

Organizing guidelines are available at .


In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.


The TSP 2019 is IEEE technically co-sponsored Conference organized in 
cooperation with eighteen universities:

  * BrnoUniversity of Technology, Department of Telecommunications,
    Brno, Czech Republic
  * BudapestUniversity of Technology and Economics, Department of
    Telecommunications and Media Informatics, Budapest, Hungary
  * CzechTechnical University in Prague, Department of Telecommunication
    Engineering, Prague, Czech Republic
  * IsikUniversity, Department of Electrical and Electronics
    Engineering, Sile/Istanbul, Turkey
  * IstanbulTechnical University, Electronics and Communication
    Engineering Department, Istanbul, Turkey
  * JosipJuraj Strossmayer University of Osijek, Faculty of Electrical
    Engineering, Computer Science and Information Technology Osijek,
    Osijek, Croatia
  * KaradenizTechnical University, Department of Electrical and
    Electronics Engineering, Trabzon, Turkey
  * NationalTaiwan University of Science and Technology, Department of
    Electronic and Computer Engineering, Taipei, Taiwan
  * SeikeiUniversity, Graduate School and Faculty of Science and
    Technology, Information Networking Laboratory, Tokyo, Japan
  * SlovakUniversity of Technology in Bratislava, Institute of
    Multimedia Information and Communication Technologies, Bratislava,
    Slovak Republic
  * Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
  * TechnicalUniversity of Sofia, Faculty of Telecommunications, Sofia,
  * Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée
    de Saint-Denis (LIASD), France
  * University “Politehnica” of Bucharest, Center for Advanced Research
    on New Materials, Products and Innovative Processes (“CAMPUS”)
  * Universityof Ljubljana, Laboratory for Telecommunications,
    Ljubljana, Slovenia
  * Universityof Patras, Physics Department, Patras, Greece
  * VSB - Technical University of Ostrava, Department of
    Telecommunications, Ostrava, Czech Republic
  * WestPomeranian University of Technology, Faculty of Electrical
    Engineering, Szczecin, Poland


  * Miloslav Filka, Brno University of Technology, Czech Republic – Full
    Professor, TSP Conference Founder - Honorary Chair
  * Norbert Herencsar, Brno University of Technology, Czech Republic –
    IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE
    Senior Member - General Co-Chair
  * Attila Vidacs, Budapest University of Technology and Economics,
    Hungary – Deputy Head of Department - General Co-Chair
  * Jiri Hosek, Brno University of Technology, Czech Republic – IEEE
    Member - Publications & Student Paper Contest Chair
  * Aslihan Kartci, Brno University of Technology, Czech Republic – IEEE
    Graduate Student Member - Publicity & Social Media Chair
  * Nandor Matrai, Asszisztencia Congress Bureau, Hungary – Finance Chair
  * Csilla Fulop, Asszisztencia Congress Bureau, Hungary – Registrations

Steering Committee:

  * Larbi Boubchir, Universite Paris 8, France – Associate Professor,
    IEEE Senior Member
  * Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataro,
    Tecnocampus, Spain – Full Professor, Dean
  * Izzet Cem Goknar, Isik University, Turkey – Institute of Science
    Director & Circuits and Systems (CAS) Society Turkey Chapter Chair,
    Full Professor, IEEE Life Fellow
  * Ray-Guang Cheng, National Taiwan University of Science and
    Technology (NTUST), Taiwan – Full Professor, IEEE Senior Member
  * Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor
  * Jaroslav Koton, Brno University of Technology, Czech Republic –
    Vice-dean for Research, IEEE Senior Member
  * Sridhar Krishnan, Ryerson University, Canada – Full Professor &
    Associate Dean, IEEE Senior Member
  * Mario Kusek, University of Zagreb, Croatia – IEEE Croatia Section
    Communications Chapter Chair, IEEE Member
  * Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice
    Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017,
    IEEE Senior Member
  * Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE
    Senior Member
  * Jiri Misurec, Brno University of Technology, Czech Republic – Full
    Professor, Department Chair
  * Ram M. Narayanan, The Pennsylvania State University, USA – Full
    Professor, IEEE Fellow
  * Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior
  * Serdar Ozoguz, Istanbul Technical University, Turkey – Full
    Professor, Associate Chair
  * Jakub Peksinski, West Pomeranian University of Technology, Poland
  * Hector Perez-Meana, National Polytechnic Institute, Mexico – Full
    Professor, IEEE Senior Member
  * Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full
    Professor, Dean, IEEE Senior Member
  * Costas Psychalinos, University of Patras, Greece – Full Professor,
    IEEE Senior Member
  * Markus Rupp, Vienna University of Technology, Austria – Full
    Professor, Dean, IEEE Fellow
  * Zdenek Smekal, Brno University of Technology, Czech Republic – Full
    Professor, IEEE Senior Member
  * Attila Vidacs, Budapest University of Technology and Economics,
    Hungary – Deputy Head of Department
  * Miroslav Voznak, VSB-Technical University of Ostrava, Czech Republic
    – Full Professor, Department Chair, IEEE Senior Member
  * Drago Zagar, Josip Juraj Strossmayer University of Osijek, Croatia –
    Full Professor, Dean, IEEE Senior Member


Workshop and Special Session Proposals: February 15, 2019 (extended 
Full Paper Submission: March 8, 2019 (extended deadline)
Notification of Paper Acceptance: April 15, 2019
Final Paper Submission: April 30, 2019
Authors' Early Registration and Payment: May 10, 2019
Authors' Late Registration and Payment: May 20, 2019
Listeners' Registration: July 1, 2019
Conference: July 1-3, 2019


For more information please visit the Conference website at We are also ready to answer your questions emailed 
to [log in to unmask] .

Looking forward to meeting you in Budapest, Hungary.

With best regards,

Norbert Herencsar and Attila Vidacs
TSP 2019 General Co-Chairs

E-mail: [log in to unmask]

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doc. Ing. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic


Assoc. Prof. Attila Vidacs, Ph.D.
Department of Telecommunications and Media Informatics
Faculty of Electrical Engineering and Informatics
Budapest University of Technology and Economics
Magyar tudosok korutja 2.
1117 Budapest

TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference.

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