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"ACM SIGCHI General Interest Announcements (Mailing List)" <[log in to unmask]>
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Mon, 7 Oct 2019 20:12:58 +0000
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Shijia Pan <[log in to unmask]>
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Shijia Pan <[log in to unmask]>
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This year, SenSys 2019 and BuildSys 2019 will be co-located and held at Columbia University, New York, USA. You are cordially invited to share your research with the community, enjoying the modern cityscape and Michelin star restaurants.



****REGISTRATION****
The early registration option for conferences and workshops are available until 23:59 pm ET Oct 11th, 2019.

Please register here: http://sensys.acm.org/2019/registration/



****VISA****
We'd like to draw your attention to the Visa requirement: ACM is able to provide visa support letters to attendees as well as authors with accepted papers, posters, or members of the conference committee.

For visa support letters, refer all requests to [log in to unmask]<mailto:[log in to unmask]>. Please allow up to 10 business days to receive a letter. All requests are handled in the order they are received. The information below should be included with the request:

o    Your name as it appears on your passport

o    Your current postal mailing address

o    The name of the conference you are registering for

o    Your registration confirmation number

o    If you have any papers accepted for the conference, please provide the title and indicate whether you are the "sole author" or a "co-author"

o    Authors may indicate their paper title. If no paper, speakers can provide the title of their presentation

ACM does not provide letters for transport of vendor or presenter equipment. ACM suggests shipping the materials insured to the conference facility.



More information can be found on the conference website soon: http://sensys.acm.org/2019/



We look forward to meeting you in New York!
SenSys 2019 Organizing Committee

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