CHI-ANNOUNCEMENTS Archives

ACM SIGCHI General Interest Announcements (Mailing List)

CHI-ANNOUNCEMENTS@LISTSERV.ACM.ORG

Options: Use Forum View

Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
text/plain; charset=utf-8; format=flowed
Date:
Sun, 16 Feb 2020 17:45:02 +0100
Reply-To:
"IEEE R8 Tech. Co-Sponsored TSP 2020" <[log in to unmask]>
Subject:
MIME-Version:
1.0
Message-ID:
Content-Transfer-Encoding:
quoted-printable
Sender:
"ACM SIGCHI General Interest Announcements (Mailing List)" <[log in to unmask]>
From:
"IEEE R8 Tech. Co-Sponsored TSP 2020" <[log in to unmask]>
Parts/Attachments:
text/plain (329 lines)
** [ We apologize if you receive multiple copies of this email. Please 
distribute this CfP to your colleagues. ] **
*
2020 43rd International Conference on Telecommunications and Signal 
Processing (TSP)*

*July 7-9, 2020, Milan, Italy
Web: *http://tsp.vutbr.cz/

• *Full Paper Submission:* March 9, 2020 (extended deadline, 22 extra days)

************************************************************************************

*Technical co-sponsors:* /IEEE Region 8 (Europe, Middle East and 
Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section 
VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia 
Section SP/CAS/COM Joint Chapter, and Scientific Association for 
Infocommunications, a Sister Society of the IEEE and the IEEE 
Communications Society.

The TSP 2020 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the IEEE Xplore® Digital Library - 
IEEE Conference Record #49548, SCOPUS, Conference Proceedings Citation 
Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

/*After the conference, authors of about 25% highest rated papers will 
also be invited to submit the extended version for publishing in Special 
Journal Issues (papers to be published after significant extension and 
new review process):
*/
• Special Issue Selected Papers from the 2020 43rd International 
Conference on Telecommunications and Signal Processing (TSP) of an 
*Applied Sciences* (ISSN 2076-3417), an international peer-reviewed open 
access journal on all aspects of applied natural sciences published by 
MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor: 
2.217)
• *International Journal of Advances in Telecommunications, 
Electrotechnics, Signals and Systems (IJATES)* (ISSN 1805-5443), indexed 
by Google Scholar, CrossRef, WorldCat, EZB Elektronischen 
Zeitschriftenbibliothek, and Directory of Open Access Journals
/
************************************************************************************

Dear Colleagues and Friends,

You are kindly invited to participate in the *2020 43rd International 
Conference on Telecommunications and Signal Processing (TSP - 
/http://tsp.vutbr.cz/)*, which will be held on *July 7-9, 2020in Milan, 
Italy*. The TSP Conference serves as a premier annual international 
forum to promote the exchange of the latest advances in 
telecommunication technology and signal processing. The aim of the 
Conference is to bring together both novice and experienced scientists, 
developers, and specialists, to meet new colleagues, collect new ideas, 
and establish new cooperation between research groups from universities, 
research centers, and private sectors from the whole Europe, America, 
Asia, Australia, and Africa.

*OPENING KEYNOTE SPEAKER:
*
We are glad to announce the following Opening Keynote Speaker:

• *Prof. Dr. Ian F. Akyildiz, IEEE & ACM Fellow* – Ken Byers Chair 
Professor in Telecommunications, Georgia Institute of Technology, USA 
(http://bwn.ece.gatech.edu/IFA/)
.... */Title/*: 6G: Next Frontier in Wireless Communication Research

The next generation of wireless communication networks, or 6G, will 
fulfill a fully connected world and provide ubiquitous wireless 
connectivity for all. Transformative solutions are expected to drive the 
surge to accommodating a drastically growing number of intelligent 
devices and services.

Major technological breakthroughs to achieve the goals in 6G include:
(i) a network operating at the Terahertz (THz) bandwidth much wider 
spectrum resources,
(ii) the Internet of NanoThings,
(iii) the Internet of BioNanoThings,
(iv) cell-free massive MIMO communication networks to accommodate more 
users,
(v) intelligent communication environments that enable a wireless 
propagation environment with active signal transmission and reception,
(vi) an all-spectrum reconfigurable front-end for dynamic spectrum access,
(vii) quantum communications for extremely fast computation and 
processing of parallel data streams,
(viii) pervasive artificial intelligence, (ix) ambient backscatter 
communications for energy savings,
(x) the Internet of Space Things enabled by CubeSats, and
(xi) network automation for error-free network operations.

In this roadmap talk, use cases for these enabling techniques as well as 
recent advancements on related topics are highlighted, and open problems 
with possible solutions are discussed, followed by a development 
timeline outlining the worldwide efforts in the realization of 6G.

*/TOPICS:/**
*
TSP 2020 has opened *Call for Full Paper Submissions* with an *EXTENDED* 
deadline set for *March 9, 2020 (22 extra days)*. We look forward to 
your innovative contributions in any of the following areas:

/AREA 1: Telecommunications/

   1. Information Systems
   2. Network Services
   3. Network Technologies
   4. Telecommunication Systems
   5. Modelling, Simulation and Measurement

/AREA 2: Signal Processing/

   6. Analog Signal Processing
   7. Audio, Speech and Language Processing
   8. Biomedical Signal Processing
   9. Digital Signal Processing
   10. Image and Video Signal Processing

For more details please visit the Conference website at 
http://tsp.vutbr.cz/?page_id=121 .

*/WORKSHOPS AND SPECIAL SESSIONS:/**
*
Prospective Organizers are invited to submit proposals for Workshops and 
Special Sessions held during the TSP 2020 Conference. The following 
Workshop and Special Sessions were approved so far:

• *WS1: 2nd International Workshop on Signal Processing Techniques for 
Ground Penetrating Radar Applications (SPT4GPRA) *organized by Dr. Fabio 
Tosti, PhD, Prof. Dr. Amir M. Alani, PhD (both University of West London 
(UWL), London, UK), Prof. Dr. Evert Slob, PhD (Delft University of 
Technology, Delft, The Netherlands), and Dr. Francesco Soldovieri, PhD 
(National Research Council, Naples, Italy)

• *WS2: International Workshop on Advanced Network Technologies and 
IoT*organized by Assoc. Prof. Jorge Crichigno (University of South 
Carolina, U.S.A.), Assoc. Prof. Gautam Srivastava (Brandon University, 
Canada), and Prof. Dr. Neset Hikmet (University of South Carolina, U.S.A.)

• *SS1: Special Session on Multimodal Signal Processing and 
Classification*organized by Prof. Dr. Corneliu Burileanu and Assoc. 
Prof. Dr. Anamaria Radoi (both with the University Politehnica of 
Bucharest, Romania)

• *SS2. Special Session on Photonic Fibre Networks and their 
Applications (Theory, Design, Modelling, Simulations, Operation, 
Trials)*organized by Dr. Josef Vojtech (CESNET a.l.e., Czech Republic) 
and Dr. Tomas Horvath (CESNET a.l.e. and Brno University of Technology, 
Czech Republic)

Organizing guidelines are available at http://tsp.vutbr.cz/?page_id=3492 .

*/STUDENT BEST PAPER AWARD:
/*/
/In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.

*/TSP ORGANIZERS:
/*/
/The TSP 2020 is IEEE technically co-sponsored Conference organized in 
cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
• Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
Croatia
• Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia 
Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, 
Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de 
Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on 
New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

*/COMMITTEES:/*

• /Honorary Chair/ - Miloslav Filka, Brno University of Technology, 
Czech Republic – Full Professor, TSP Conference Founder
• /General Co-Chair/ - Norbert Herencsár, Brno University of Technology, 
Czech Republic – IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter 
Chair, IEEE Senior Member
• /General Co-Chair/ - Francesco Benedetto, University of “Roma TRE”, 
Italy – Full Professor, IEEE Senior Member
• /Publications & Student Paper Contest Chair/ - Jiří Hošek, Brno 
University of Technology, Czech Republic – IEEE Member
• /Publicity & Social Media Chair/ - Aslihan Kartci, Brno University of 
Technology, Czech Republic – IEEE Member
• /Finance Chair/ - Nándor Mátrai, Asszisztencia Congress Bureau, 
Hungary – Managing Director
• /Registrations Chair/ - Csilla Fülöp, Asszisztencia Congress Bureau, 
Hungary – Project Manager

/Steering Committee:
/
• Larbi Boubchir, Université Paris 8, France – Associate Professor, IEEE 
Senior Member
• Marcos Faundez-Zanuy, Escola Universitària Politècnica de Mataró, 
Tecnocampus, Spain – Full Professor, Dean
• İzzet Cem Göknar, Işık University, Turkey – Institute of Science 
Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full 
Professor, IEEE Life Fellow
• Ray-Guang Cheng, National Taiwan University of Science and Technology 
(NTUST), Taiwan – Full Professor, IEEE Senior Member
• Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor
• Jaroslav Koton, Brno University of Technology, Czech Republic – 
Vice-dean for Research, IEEE Senior Member
• Sridhar Krishnan, Ryerson University, Canada – Full Professor & 
Associate Dean, IEEE Senior Member
• Mario Kušek, University of Zagreb, Croatia – IEEE Croatia Section 
Communications Chapter Chair, IEEE Member
• Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair 
Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior 
Member
• Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior 
Member
• Jiří Mišurec, Brno University of Technology, Czech Republic – Full 
Professor, Department Chair
• Ram M. Narayanan, The Pennsylvania State University, USA – Full 
Professor, IEEE Fellow
• Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior 
Member
• Serdar Özoğuz, Istanbul Technical University, Turkey – Full Professor, 
Associate Chair
• Jakub Pęksiński, West Pomeranian University of Technology, Poland
• Hector Perez-Meana, National Polytechnic Institute, Mexico – Full 
Professor, IEEE Senior Member
• Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full 
Professor, Dean, IEEE Senior Member
• Costas Psychalinos, University of Patras, Greece – Full Professor, 
IEEE Senior Member
• Markus Rupp, Vienna University of Technology, Austria – Full 
Professor, Dean, IEEE Fellow
• Zdeněk Smékal, Brno University of Technology, Czech Republic – Full 
Professor, IEEE Senior Member
• Attila Vidács, Budapest University of Technology and Economics, 
Hungary – Deputy Head of Department
• Miroslav Vozňák, VŠB-Technical University of Ostrava, Czech Republic – 
Full Professor, Department Chair, IEEE Senior Member
• Drago Žagar, Josip Juraj Strossmayer University of Osijek, Croatia – 
Full Professor, Dean, IEEE Senior Member

*/IMPORTANT DATES:
/*/
/• *Full Paper Submission:* March 9, 2020 (extended deadline, 22 extra days)
• *Notification of Paper Acceptance: *April 15, 2020
• *Final Paper Submission:* April 30, 2020
• *Authors' Early Registration and Payment:* May 10, 2020
• *Authors' Late Registration and Payment:* May 20, 2020

*/CONTACTS:/*/

/For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to [log in to unmask] .

Looking forward to meeting you in Milan, Italy.

With best regards,

Norbert Herencsar and Francesco Benedetto
TSP 2020 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: [log in to unmask]

Follow us on:
• *Facebook*: https://www.facebook.com/tspconf/
• *Twitter*: https://twitter.com/tspconf/
===================================================
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

&

Prof. Francesco Benedetto
Signal Processing for Telecommunications and Economics (SP4TE)
University of "Roma TRE"
via Vito Volterra, 62
00146 Rome
Italy

************************************************************************************
/TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference.
/************************************************************************************


    ---------------------------------------------------------------
    For news of CHI books, courses & software, join CHI-RESOURCES
     mailto: [log in to unmask]

    To unsubscribe from CHI-ANNOUNCEMENTS send an email to
     mailto:[log in to unmask]

    For further details of CHI lists see http://listserv.acm.org
    ---------------------------------------------------------------

ATOM RSS1 RSS2