CHI-ANNOUNCEMENTS Archives

ACM SIGCHI General Interest Announcements (Mailing List)

CHI-ANNOUNCEMENTS@LISTSERV.ACM.ORG

Options: Use Forum View

Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
text/plain; charset="Windows-1252"
Date:
Sat, 8 Oct 2022 01:01:25 +0000
Reply-To:
Suranga Seneviratne <[log in to unmask]>
Subject:
MIME-Version:
1.0
Message-ID:
Content-Transfer-Encoding:
quoted-printable
Sender:
"ACM SIGCHI General Interest Announcements (Mailing List)" <[log in to unmask]>
From:
Suranga Seneviratne <[log in to unmask]>
Parts/Attachments:
text/plain (70 lines)
*** Please accept our apologies if you receive multiple copies of this CFP ***

==========================================================
CALL FOR PAPERS
******************************************************************
The 21th International Conference on Pervasive Computing and
Communications (PerCom 2023), March 13-17, 2023
Atlanta, USA
Work in Progress (WiP) Session
https://www.percom.org/work-in-progress-wip-session/
******************************************************************

The Work in Progress (WiP) session provides an opportunity to present and discuss new challenges and visions, showcase early research results, and explore novel research directions. The specific aim of the WiP session is to provide a forum for timely presentation, discussion and feedback for novel, controversial, and thought-provoking ideas. Contributions are solicited in all areas of pervasive computing research and applications. Papers are expected to report on early or ongoing research on any aspect of pervasive computing and communications. Preliminary experimental results are appreciated.

All selected papers must be presented. They will be included in PerCom Workshops proceedings to be published by IEEE and included in the IEEE Xplore digital library. The WiP Chairs and the WiP Program Committee will also select the best WiP contribution based on submissions and presentations.

Topics of interest include, but are not limited to:

Advances in pervasive systems and infrastructures: middleware systems and services; data engineering for pervasive computing; clouds, fog and edge computing; integrations of smartphones in pervasive experiences; applications of device-to-device coordination

Theories, models, and algorithms: context modeling and reasoning; adaptive computing; activity and emotion recognition; programming paradigms; applied machine learning; deep machine learning; federated learning; casual learning; cognitive computing; complex networks; spatio-temporal modeling techniques

Domain-specific challenges and novel applications: urban/mobile crowdsensing & intelligence; PerCom for healthcare and well-being; cyber-physical PerCom; smart homes and virtual assistants; innovative PerCom applications (e.g., sports analytics, crime prevention, pervasive nowcasting)

Intersections of PerCom with: opportunistic networks; IoT and sensor systems; RFID systems; pervasive data science, cyber physical systems

New techniques for user-level concerns: participatory and social sensing; trust, security, and privacy; user interface, interaction, and persuasion; online and offline social networking and pervasive computing

Technological innovations: architectures, protocols, and technologies for pervasive communications; energy-harvesting, self-powered, or battery-less systems; mobile and wearable systems; smart devices and environments; positioning and tracking technologies; wireless crowd-recharging; device-free human sensing

Submission Guidelines

Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format (two-column format with a 4-page limit including figures, tables, and references, US letter size (8.5 by 11 inches)) in PDF format that include contact information of all the authors. The official IEEE manuscript templates for conference proceedings, as well as more detailed formatting instructions, can be found at https://www.ieee.org/conferences/publishing/templates.html. All submitted manuscripts will be reviewed by the WiP Technical Program Committee. The authors of accepted papers will present their work during the main conference. At least one author must have a full conference registration.

All manuscripts must be registered and submitted through the EDAS submission site (https://edas.info/N30108) prior to the submission deadline.

Important Dates

Submission Deadline: December 9, 2022
Notification of Acceptance: January 16, 2023
Camera Ready Deadline: January 30, 2023
Conference Dates: March 13 – 17, 2023
All deadlines are 23:59 AoE. For more information, check the PerCom Important Dates page.

WiP Chairs

Delphine Reinhardt, University of Goettingen, Germany
Simone Silvestri, University of Kentucky, USA
TPC

Corey Baker, University of Kentucky
Francesco Restuccia, Northeastern University
Gabriele Civitarese, University of Milan
Jennifer Simonjan, Lakeside Labs
Kristina Yordanova, University of Greifswald
Marco Ortolani, Keele University
Nathalie Mitton, Inria Lille – Nord Europe
Nathaniel Hudson, University of Chicago
Viviana Arrigoni, Sapienza University of Rome
For further information about the Work in Progress portion of the program, please contact the WiP Co-Chairs Delphine Reinhardt ([log in to unmask]) and Simone Silvestri ([log in to unmask]).


    ----------------------------------------------------------------------------------------
    To unsubscribe from CHI-ANNOUNCEMENTS send an email to:
     mailto:[log in to unmask]

    To manage your SIGCHI Mailing lists or read our polices see:
     https://sigchi.org/operations/listserv/
    ----------------------------------------------------------------------------------------

ATOM RSS1 RSS2