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"IEEE R8 Tech. Co-Sponsored TSP 2020" <[log in to unmask]>
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***   4th International Workshop on Recent Advances in Biometrics and 
its Applications   ***
***        https://tsp.vutbr.cz/documents/TSP2020_CFP_WS3_v3.pdf ***

2020 43rd International Conference on Telecommunications and Signal 
Processing (TSP)
July 7-9, 2020, Milan, Italy
Web: http://tsp.vutbr.cz/

Full Paper Submission: March 9, 2020 (extended deadline)

************************************************************************************
Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), 
IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint 
Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section 
SP/CAS/COM Joint Chapter, and Scientific Association for 
Infocommunications, a Sister Society of the IEEE and the IEEE 
Communications Society.

The TSP 2020 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the IEEE Xplore® Digital Library - 
IEEE Conference Record #49548, SCOPUS, Conference Proceedings Citation 
Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, authors of about 25% highest rated papers will 
also be invited to submit the extended version for publishing in Special 
Journal Issues (papers to be published after significant extension and 
new review process):

• Special Issue Selected Papers from the 2020 43rd International 
Conference on Telecommunications and Signal Processing (TSP) of an 
Applied Sciences (ISSN 2076-3417), an international peer-reviewed open 
access journal on all aspects of applied natural sciences published by 
MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor: 
2.217)
• International Journal of Advances in Telecommunications, 
Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed 
by Google Scholar, CrossRef, WorldCat, EZB Elektronischen 
Zeitschriftenbibliothek, and Directory of Open Access Journals
************************************************************************************

Dear Colleague,

Biometric recognition has become a burgeoning research area due to the 
industrial and government needs for recognition, security and privacy 
concerns. It has also become center of focus for many authentication and 
identification applications in the civil and forensic fields. Within the 
framework of the 2020 43th International Conference on 
Telecommunications and Signal Processing (TSP) held during July 7-9, 
2020, in Milan, Italy, we invite you to the 4th International Workshop 
on Recent Advances in Biometrics and its Applications. The goal of this 
workshop is to present and discuss the recent fundamental and applied 
research works, providing novel solutions to challenging problems in 
biometrics. It is an opportunity to bring researchers and experts 
together to discuss the current and future state of biometrics and 
possible areas of further cooperation. Topics of interest include, but 
are not limited to, the following:

• Biometrics based authentication and identification
• Physiological and behavioral biometrics
• Signal, image and video processing in biometrics
• Machine learning in biometrics
• Artificial intelligence in biometrics
• Fusion techniques in biometrics
• Soft biometrics
• Multimodal biometrics
• Biometric security and privacy
• Big data challenges in biometrics
• Related applications

For more details please visit the Conference website.

EDITORIAL BOARD:

- Assoc. Prof. Dr. Larbi Boubchir — LIASD - University of Paris 8, 
France (Editor-in-Chief, [log in to unmask])
- Prof. Boubaker Daachi — LIASD - University of Paris 8, France 
([log in to unmask])

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.

TSP ORGANIZERS:

The TSP 2020 is IEEE technically co-sponsored Conference organized in 
cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
• Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
Croatia
• Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia 
Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, 
Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de 
Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on 
New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

IMPORTANT DATES:

• Full Paper Submissions: March 9, 2020 (extended deadline)
•  Notification of Paper Acceptance: April 15, 2020
• Final Paper Submission: April 30, 2020
• Authors' Early Registration and Payment: May 10, 2020
• Authors' Late Registration and Payment: May 20, 2020
• Conference: July 7-9, 2020

CONTACTS:

For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to [log in to unmask] .

Looking forward to meeting you in Milan, Italy.

With best regards,

Norbert Herencsar and Francesco Benedetto
TSP 2020 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: [log in to unmask]

Follow us on:
• Facebook: https://www.facebook.com/tspconf/
• Twitter: https://twitter.com/tspconf/
===================================================
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

&

Prof. Francesco Benedetto
Signal Processing for Telecommunications and Economics (SP4TE)
University of "Roma TRE"
via Vito Volterra, 62
00146 Rome
Italy

************************************************************************************
TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference.
************************************************************************************

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