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TSP 2019 <[log in to unmask]>
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Mon, 21 Jan 2019 14:11:52 +0100
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--- Selected high-quality papers will be invited for publication in 
*Special Issue "Recent Advances in Biometrics and its Applications"* in 
*Electronics *journal (SJR Q1, IF: 2.11), see: 

*** *3rd International Workshop on Recent Advances in Biometrics and its 
Applications*   ***
*** ***

*2019 42nd International Conference on Telecommunications and Signal 
Processing (TSP)*
July 1-3, 2019, Budapest, Hungary

*Full Paper Submission:* February 15, 2019

*Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa)*, 
IEEE Hungary Section**, IEEE Czechoslovakia Section**, and IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter*** [* pending approval; 
** approved].

The TSP 2019 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the *IEEE Xplore® Digital Library**, 
*SCOPUS*, *Conference Proceedings Citation Index (CPCI) of Thomson 
Reuters*, *DBLP*, and *Google Scholar* databases.

Dear Colleague,

Biometric recognition has become a burgeoning research area due to the 
industrial and government needs for security and privacy concerns. It 
has also become center of focus for many authentication and 
identification applications in the civil and forensic fields. Within the 
framework of the *2019 42nd International Conference on 
Telecommunications and Signal Processing (TSP)* held during *July 1-3, 
2019* in *Budapest*, *Hungary*, we invite you to the /3rd International 
Workshop on Recent Advances in Biometrics and its Applications/. The 
goal of this workshop is to present and discuss the recent fundamental 
and applied research works providing novel solutions to challenging 
problems in biometrics. It is an opportunity to bring researchers and 
experts together to discuss the current and future state of biometrics 
and possible areas of further cooperation. Topics of interest include, 
but are not limited to, the following:

- Biometrics based authentication and identification
- Physiological and behavioral biometrics
- Biometric feature extraction and matching
- Signal, image and video processing in biometrics
- Machine learning in biometrics
- Fusion techniques in biometrics
- Soft biometrics
- Multimodal biometrics
- Biometric security and privacy
- Big data challenges in biometrics
- Related applications

For more details please visit the Conference website at .


- Assoc. Prof. Dr. Larbi Boubchir — LIASD - University of Paris 8, 
France (Editor-in-Chief, [log in to unmask])
- Prof. Boubaker Daachi — LIASD - University of Paris 8, France 
([log in to unmask])


In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.


The TSP 2019 will be *IEEE technically co-sponsored Conference organized 
in cooperation with eighteen universities:

- Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
- Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
- Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
- Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology in Bratislava, Institute of 
Telecommunications, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, 
- Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de 
Saint-Denis (LIASD), France
- University “Politehnica” of Bucharest, Center for Advanced Research on 
New Materials, Products and Innovative Processes (“CAMPUS”)
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland


Full Paper Submission: February 15, 2019
Notification of Paper Acceptance: April 15, 2019
Final Paper Submission: April 30, 2019
Authors' Late Registration and Payment: May 20, 2019
Listeners' Registration: July 3, 2019
Conference: July 1-3, 2019


For more information please visit the Conference website at We are also ready to answer your questions emailed 
to [log in to unmask] .

Looking forward to meeting you in Budapest, Hungary.

With best regards,

Norbert Herencsar and Attila Vidacs
TSP 2019 General Co-Chairs

E-mail: [log in to unmask]

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doc. Ing. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic


Assoc. Prof. Attila Vidacs, Ph.D.
Department of Telecommunications and Media Informatics
Faculty of Electrical Engineering and Informatics
Budapest University of Technology and Economics
Magyar tudosok korutja 2.
1117 Budapest

TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in *IEEE Xplore® and other 
databases) if the paper is not presented at the Conference.

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