CHI-ANNOUNCEMENTS Archives

ACM SIGCHI General Interest Announcements (Mailing List)

CHI-ANNOUNCEMENTS@LISTSERV.ACM.ORG

Options: Use Classic View

Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Topic: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mattia Campana <[log in to unmask]>
Thu, 3 Jun 2021 14:15:01 +0200
text/plain (194 lines)
[Apologies if you receive multiple copies of this message]

=======================================================



		                  SMARTCOMP 2021: JOINT CALL FOR WIP-DEMO, INDUSTRY TRACK, TUTORIALS, AND Ph.D. FORUM

****************************************************************************************************************************************************************************************

The 7th IEEE International Conference on Smart Computing (SMARTCOMP 2021), August 23-27, 2021.
Due to uncertainties associated with the pandemic, SMARTCOMP 2021 will be held as a virtual conference.


https://www.smart-comp.info

****************************************************************************************************************************************************************************************

The 7th IEEE International Conference on Smart Computing (SMARTCOMP 2021) draws upon many application disciplines such as transportation, energy, environmental protection, resource management, healthcare, security, banking, entertainment, and social media.


————————————————————————————————————————————————

Workshops

————————————————————————————————————————————————

** Please check the respective workshop's weblink for submission deadlines **

BITS 2021: 5th International Workshop on Big Data and IoT Security in Smart Computing
https://www.yama.info.waseda.ac.jp/bits2021/

EdgeDL 2021: 4th International Workshop on EdgeDL: Deep Learning on Edge for Smart Health and Wellbeing Applications
https://sites.google.com/view/ieee-edgedl-2021/home

paiIoT 2021: 1st International Workshop on Pervasive Artificial Intelligence towards IoT Edge Computing and Smart Inference
https://sites.google.com/view/paiIoT2021

SmartSys 2021: 6th International Workshop on Smart Service Systems
https://www.scm.keele.ac.uk/smartsys2021/

SSC 2021: 7th International Workshop on Sensors and Smart Cities
http://ssc2021.unime.it/




————————————————————————————————————————————————

Work In Progress (WIP) & DEMO papers

————————————————————————————————————————————————

In addition to full-length technical papers, SMARTCOMP welcomes Work in Progress (WIP) papers and technical demonstrations (Demos) showing innovative and original research in the areas of smart computing. Submissions from both industry and academia are strongly encouraged.

WIP papers are expected to report on early or ongoing research activities, while Demo papers are expected to present innovative applications and tools.

The WIP and Demo sessions will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research questions, approaches, and directions.



TOPICS

Areas of interest include (but are not limited to):



* Smart Computing Technologies and Applications

* Smart Cyber-Physical Systems and Energy/ Water/ Agriculture/ Transportation/ Healthcare/ Banking Infrastructure

* Future Smart Computing Paradigms

* Smart Human Environments, Health, Entertainment, and Social Activities

* Smart Computing for Environmental change (e.g., Energy Management and Analytics, Smart Transportation)

* Big Data, Artificial Intelligence and Machine Learning for Smart Computing

* Middleware Platforms for Smart Environments

* Mobile and Ubiquitous Platforms for Smart Environments

* Cloud, Edge and Fog Computing Platforms for Smart Systems

* Security, Privacy, and Economics in Smart Environments



SUBMISSION GUIDELINES:

WIP and Demo papers should be no more than 3 pages in length, including figures, tables, and references and formatted according to the two-column IEEE proceedings template. IEEE provides corresponding formatting templates at *IEEE conference template*. Make sure to use the conference mode of the template, i.e., LaTeX users must use the conference option of the IEEEtran document class.

WIP papers are expected to present early or ongoing research activities. Novel approaches and preliminary results are especially appreciated.

Demo papers should explicitly state what will be demonstrated to the audience, and how the attendees will be able to interact, enjoy, and experiment.



Papers must be submitted electronically as a single PDF file on US Letter size paper (not A4), with all fonts embedded (the PDF-A standard complies with that), through EDAS – WiP and Demo Track.

Submitted WIP and Demo papers will be subject to peer reviews by SMARTCOMP Technical Program Committee members and other experts in the field. 

All accepted papers will be published in the conference proceedings, and submitted to the IEEE Xplore Digital Library. They will be presented as posters. At least one author of each accepted paper must register and attend the conference to present the work.

Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format in PDF. Paper submissions should be formatted according to the IEEE conference template. 



Due to the short interval between the notification of acceptance and the camera-ready deadline, we strongly encourage authors to follow the camera-ready formatting guidelines as close as possible even for the initial abstract submission.

Submissions must be made via EDAS.

When submitting, please select the “SMARTCOMP 2021: WIP and Demo” track. 



IMPORTANT DATES:

* Paper Submission: 4 June, 2021 [Extended deadline]
* Acceptance Notification: 20 June, 2021
* Camera ready: 30 June, 2021



WIP AND DEMO CO-CHAIRS:

Franca Delmastro, IIT-CNR, Italy ([log in to unmask])

Simone Silvestri, University of Kentucky, USA ([log in to unmask])





————————————————————————————————————————————————

INDUSTRY TRACK

————————————————————————————————————————————————

In addition to the research track, this year SMARTCOMP will have a dedicated Industry Track. Accepted papers will be published as part of a separate section of the main conference proceedings that highlights the Industry relevance of the submission. An important criterion for papers to be submitted to the Industry Track is clear industrial association, either in the form of extensive evaluation of research results in industrial use cases or active participation of industry representatives as co-authors. The industry track will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research questions, approaches, and directions, with an industry focus.



TOPICS:

Areas of interest include (but are not limited to):

* Smart Computing Technologies and Applications

* Smart Cyber-Physical Systems and Energy/ Water/ Agriculture/ Transportation/ Healthcare/ Banking Infrastructure

* Future Smart Computing Paradigms

* Smart Human Environments, Health, Entertainment, and Social Activities

* Smart Computing for Environmental change (e.g., Energy Management and Analytics, Smart Transportation)

* Big Data, Artificial Intelligence and Machine Learning for Smart Computing

* Middleware Platforms for Smart Environments

* Mobile and Ubiquitous Platforms for Smart Environments

* Cloud, Edge and Fog Computing Platforms for Smart Systems

* Security, Privacy, and Economics in Smart Environments



SUBMISSION GUIDELINES:

The submissions in IEEE conference format may be either full-paper (up to 6 pages) or short papers (up to 4 pages) which may be work-in-progress. The page limit includes references and submissions which do not follow the page limits will be automatically rejected. Having the industry relevance condition in mind, contributions related to ongoing or finished, but previously unpublished research papers are welcome. Submissions from a broad spectrum of research fields with common interest in smart computing are expected. 



Papers must be submitted electronically as a single PDF file through EDAS. All submissions will be reviewed by at least 2 members of the Program Committee -- the review process is not blind and authors can choose to include the author list in the submission. 



IMPORTANT DATES:

* Abstract submission: June 15, 2021
* Paper Submission Deadline: June 22, 2021
* Acceptance Notification: July 22, 2021
* Camera Ready Deadline: August 2, 2021



INDUSTRY TRACK CO-CHAIRS:

Bhaskar Krishnamachari, University of Southern California, USA (Email: [log in to unmask])

Mallik Tatipamula, Ericsson Silicon Valley, USA (Email: [log in to unmask])



TECHNICAL PROGRAM COMMITEE:

Huan Nguyen, Middlesex University

Bassant Selim, Ericsson

Hakimeh Purmehdi, Ericsson

Shyam Kapadia, Cisco

Scott Moeller, Facebook

Avinash Kalyanaraman, Cisco



CONTACTS:

For any Information about the industry track, please contact the Industry Track Chairs.





————————————————————————————————————————————————

TUTORIALS

————————————————————————————————————————————————

The IEEE SMARTCOMP 2021 Organizing Committee invites proposals for tutorials. We will consider tutorials on any topic if the proposal makes a strong argument that such a tutorial serves an important function for the SMARTCOMP community. Tutorials should be of interest to a substantial part of the SMARTCOMP audience and represent a sufficiently mature area of research or practice. Topics include pervasive/ubiquitous computing, edge cloud computing, software defined networking,  sensor networks, decision making under uncertainty, IoT, big data analytics, security and privacy, social computing, cognitive computing, cyber-physical systems and their application and validation within smart computing environments (smart buildings, smart cities, smart grids, precision agriculture and other innovations contributing to smart living).



SUBMISSION GUIDELINES:

- Title of the tutorial

- Duration (half or full day)

- Contact information of the presenter(s), including name, email, and affiliation

- Short biography of the organizer(s)

- Description of the potential target audience for the tutorial

- List of speakers

- Past history of the tutorial event

- Virtual-only tutorial plan



Proposals will be evaluated based on the general interests to the SmartComp participants, quality of the proposal and expertise of the presenters. If accepted, the tutorial organizers are required to provide a website that will contain links of the tutorial materials to the chairs one month prior to the conference, with preliminary content that will be used in calls for participation. It will not be possible to host tutorials that require laboratory or PC access for the audience (no mandatory “hands-on” tutorials). The conference organizers reserve the right to cancel a tutorial if too few attendees are registered. 

 

IMPORTANT DATES:

* Proposal Submission Registration Deadline: 10 June, 2021
* Proposal Acceptance Notification: 30 June, 2021
* Submission of camera-ready deadline: 1 July, 2021



TUTORIAL CO-CHAIRS:

Marco Levorato (UC, Irvine, USA)

Abhishek Dubey (Vanderbilt University, USA)





————————————————————————————————————————————————

Ph.D. FORUM

————————————————————————————————————————————————

The Ph.D. Forum at SMARTCOMP 2021 provides an opportunity for Ph.D. students to present their work in progress to the scientific community and obtain individual feedback from leading researchers in the field. This forum is intended to provide doctoral students with a platform to interact with established researchers from both academia and industry in the smart and pervasive computing area, and get useful guidance on the broader impacts of their research.

The Forum will be structured as a poster presentation session by the students, followed by collective discussions. The student presentations will be interleaved with speeches by leading researchers, who will provide their own perspectives on current and future research in the field, as well as on how to best pursue a Ph.D. in this context.



Current Ph.D. students at any stage of their career are encouraged to submit a 2-page extended abstract about their research to be considered for the Ph.D. Forum. The student should be the sole author, although contributions of the advisor and others should be acknowledged.



Submissions will be reviewed by the Ph.D. Forum program committee to ensure quality, relevance, and potential benefit from attendance to the Forum. There will be no separate registration fee for the Forum. Participating students will only need to register to the main SMARTCOMP conference. Authors of accepted submissions are expected to participate in person to the Forum (or via online meeting in the case the main conference will be held in either a hybrid or fully online mode depending on the pandemic situation). The proceedings of the Forum will be included in the proceedings of the main conference.



SUBMISSION GUIDELINES:

- Abstract: should be no more than 2 pages in length, including figures, tables, and references.

- Letter of support: the Ph.D. advisor of the author should email a letter of support directly to the two co-chairs, as a PDF attachment.



Authors are requested to submit manuscripts in standard IEEE proceedings format in PDF. All submissions must be typeset in double-column IEEE format using 10pt fonts on US letter paper, with all fonts embedded. Submitted abstracts must include the contact information of the authors. Please make sure you use the latest version of the templates to prepare your submissions. IEEE provides corresponding formatting templates at https://www.ieee.org/conferences/publishing/templates.html



Abstracts + letters of support must be submitted via email to:

[log in to unmask]        and 

[log in to unmask] 



In the submission email, please use the subject line “SMARTCOMP 2021: PhD Forum”.



IMPORTANT DATES:

* Abstract submission deadline: June 5, 2021
* Letter of support submission deadline: June 5, 2021
* Notification of acceptance: June 19, 2021
* Submission of camera-ready deadline: July 1, 2021





Ph.D. Forum Co-Chairs:

Paolo Bellavista, University of Bologna, Italy (Email: [log in to unmask])

Qi Han, Colorado School of Mines, USA (Email: [log in to unmask])






    ----------------------------------------------------------------------------------------
    To unsubscribe from CHI-ANNOUNCEMENTS send an email to:
     mailto:[log in to unmask]

    To manage your SIGCHI Mailing lists or read our polices see:
     https://sigchi.org/operations/listserv/
    ----------------------------------------------------------------------------------------

ATOM RSS1 RSS2