CHI-ANNOUNCEMENTS Archives

ACM SIGCHI General Interest Announcements (Mailing List)

CHI-ANNOUNCEMENTS@LISTSERV.ACM.ORG

Options: Use Classic View

Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Topic: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mattia Campana <[log in to unmask]>
Tue, 6 Apr 2021 20:15:01 +0200
text/plain (69 lines)
[Apologies if you receive multiple copies of this message]
=======================================================

		                  CALL FOR WIP-DEMO PAPERS
******************************************************************
The 7th IEEE International Conference on Smart Computing (SMARTCOMP 2021), August 23-27, 2021 in Irvine, Orange County, California, USA
https://www.smart-comp.info
**********************************************************************************

The 7th IEEE International Conference on Smart Computing (SMARTCOMP 2021) draws upon many application disciplines such as transportation, energy, environmental protection, resource management, healthcare, security, banking, entertainment, and social media. In addition to full-length technical papers, SMARTCOMP welcomes Work in Progress (WIP) papers and technical demonstrations (Demos) showing innovative and original research in the areas of smart computing. Submissions from both industry and academia are strongly encouraged.

WIP papers are expected to report on early or ongoing research activities, while Demo papers are expected to present innovative applications and tools.

The WIP and Demo sessions will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research questions, approaches, and directions.

Currently the conference is planned to be in Irvine, Orange County, California, USA. 
However, there is a possibility of moving to either a hybrid or fully online mode depending on the pandemic situation. 


TOPICS
Areas of interest include (but are not limited to):

* Smart Computing Technologies and Applications
* Smart Cyber-Physical Systems and Energy/ Water/ Agriculture/ Transportation/ Healthcare/ Banking Infrastructure
* Future Smart Computing Paradigms
* Smart Human Environments, Health, Entertainment, and Social Activities
* Smart Computing for Environmental change (e.g., Energy Management and Analytics, Smart Transportation)
* Big Data, Artificial Intelligence and Machine Learning for Smart Computing
* Middleware Platforms for Smart Environments
* Mobile and Ubiquitous Platforms for Smart Environments
* Cloud, Edge and Fog Computing Platforms for Smart Systems
* Security, Privacy, and Economics in Smart Environments

WIP and Demo papers should be no more than 3 pages in length, including figures, tables, and references and formatted according to the two-column IEEE proceedings template. IEEE provides corresponding formatting templates at *IEEE conference template*. Make sure to use the conference mode of the template, i.e., LaTeX users must use the conference option of the IEEEtran document class.

WIP papers are expected to present early or ongoing research activities. Novel approaches and preliminary results are especially appreciated.

Demo papers should explicitly state what will be demonstrated to the audience, and how the attendees will be able to interact, enjoy, and experiment.

Papers must be submitted electronically as a single PDF file on US Letter size paper (not A4), with all fonts embedded (the PDF-A standard complies with that), through EDAS – WiP and Demo Track.

Submitted WIP and Demo papers will be subject to peer reviews by SMARTCOMP Technical Program Committee members and other experts in the field. 

All accepted papers will be published in the conference proceedings, and submitted to the IEEE Xplore Digital Library. They will be presented as posters. At least one author of each accepted paper must register and attend the conference to present the work.

Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format in PDF. Paper submissions should be formatted according to the IEEE conference template. 

Due to the short interval between the notification of acceptance and the camera-ready deadline, we strongly encourage authors to follow the camera-ready formatting guidelines as close as possible even for the initial abstract submission.
Submissions must be made via EDAS.
When submitting, please select the “SMARTCOMP 2021: WIP and Demo” track. 

IMPORTANT DATES:
Paper Submission: 31 May 2021
Acceptance Notification: 20 June 2021
Camera ready: 30 June 2021

WIP AND DEMO CO_CHAIRS:
Franca Delmastro, IIT-CNR, Italy ([log in to unmask])
Simone Silvestri, University of Kentucky, USA ([log in to unmask])
******************************************************************************************************

    ----------------------------------------------------------------------------------------
    To unsubscribe from CHI-ANNOUNCEMENTS send an email to:
     mailto:[log in to unmask]

    To manage your SIGCHI Mailing lists or read our polices see:
     https://sigchi.org/operations/listserv/
    ----------------------------------------------------------------------------------------

ATOM RSS1 RSS2