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Sanjay Purushotham <[log in to unmask]>
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Sanjay Purushotham <[log in to unmask]>
Mon, 20 Jan 2020 06:29:54 -0500
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[Apologies for multiple copies]

Extended Deadline - [SMARTCOMP 2020]: Call for papers

Call for Papers
22-25 June 2020, Bologna, Italy

SMARTCOMP is the premier IEEE conference on smart computing.

Smart computing is based on the synergistic combination of advances in
Sensor-based technologies, the Internet of Things (IoT), Cyber-Physical
Systems, Edge cloud computing, Big Data analytics, Machine Learning,
Cognitive Computing, and Artificial Intelligence.

Smart computing is a multidisciplinary domain. Applications of smart
computing can be found in different societal domains including, but not
limited to, transportation, energy, environmental protection, smart and
connected communities, healthcare, banking, entertainment, and social
media. Algorithmic and system advancements of edge cloud computing,
mobile/pervasive computing, cyber-physical systems, sensor networking and
social computing are taking smart computing to a new dimension and
improving our ways of living.

SMARTCOMP 2020 is the 6th edition of the conference and will be held in the
historical city of Bologna, Italy, hosted by the University of Bologna, the
holdest University of the western world. SMARTCOMP 2020 will include smart
computing innovations pertaining to pervasive/ubiquitous computing, edge
cloud computing, sensor networks, IoT, big data analytics, security and
privacy, social computing, cognitive computing, cyber-physical systems and
their application and validation within smart computing environments. This
includes applications such as smart buildings, smart cities, smart grids,
precision agriculture and other innovations contributing to smart living.

Submission Guidelines
Paper submissions must be no longer than 8 pages and formatted according to
the two-column IEEE proceedings template. IEEE provides corresponding
formatting templates at IEEE conference template. Make sure to use the
conference mode of the template, i.e., LaTeX users must use the conference
option of the IEEEtran document class.

Papers must be submitted electronically as a single PDF file on US Letter
size paper (not A4), with all fonts embedded (the PDF-A standard complies
with that), through EDAS ( Prior to
submission, ensure that any running headers/footers, page numbering, as
well as blue underlining for URLs and email addresses has been removed.

All submitted papers will be subject to peer reviews by Technical Program
Committee members and other experts in the field. All presented papers will
be published in the conference proceedings and submitted to the IEEE Xplore
Digital Library.

Extended versions of selected high quality papers accepted in IEEE
SmartComp 2020  will be considered for publication in the Elsevier's
Pervasive and Mobile Computing journal.

SMARTCOMP 2020 solicits submissions that address the fundamental questions
of smart computing, namely how to design and build smart computing systems
and how to use computing technology for resource sustainability to improve
the human experience. Submissions should thus match to at least one of the
following three major fields of interest:

Future Smart Computing Paradigms
Models of Smart Environments
Algorithms for Smart Computing
AI and Machine Learning in Smart Computing
Edge computing algorithms

Cyber-physical System Platforms for Smart Environments
Middleware Platforms for Smart Environments
Mobile and Ubiquitous Platforms for Smart Environments
Cloud/Edge/Fog computing technologies for Smart Systems
Internet of Things (IoT) and Industrial IoT technologies for Smart Systems
Smart Networking Technologies
Security, Privacy, and Economics in Smart Environments

Smart Manufacturing and Industry 4.0
Smart Precision Agriculture
Smart Transportation
Smart FinTech
Smart Food-Energy-Water Nexus/Life-cycle analysis
Smart Health
Smart Communities
Smart Human Environments, Entertainment, and Social Activities
Smart Energy Management and Analytics

Organizing Committee

General Co-Chairs:
Paolo Bellavista (University of Bologna, Italy)
Qi Han (Colorado School of Mines, USA)

Technical Program Co-Chairs:
Nirmalya Roy (University of Maryland Baltimore County, USA)
Carlo Vallati (University of Pisa, Italy)

Publicity Co-Chairs:
Shameek Bhattacharjee (Western Michigan University, USA)
Sanjay Purushotham (University of Maryland Baltimore County, USA)
Wei Wang (Xi'an Jiaotong Liverpool University, China)
Riccardo Venanzi (University of Bologna, Italy)

Web Co-Chairs:
Domenico Scotece (University of Bologna, Italy)
Francesco Di Rienzo (University of Pisa, Italy)

Publication Chair:
Francesco Longo (University of Messina, Italy)

Workshop Co-Chairs:
Dario Bruneo (University of Messina)
Eirini Eleni Tsiropoulou (University of New Mexico)

Industry Track Co-Chairs:
Abhishek Mukherji (Accenture, USA)
Akhil Mathur (Nokia Bell labs, UK)

WiP and Demo Co-Chairs:
Chayan Sarkar (TCS Research & Innovation, India)
Francesco Bronzino (Nokia Bell Labs, France)

PhD forum Co-Chairs:
Marco Tiloca (SICS, Sweden)
Sreedevi Sampath (University of Maryland Baltimore County, USA)

Steering Committee
Jiannong Cao (Hong Kong Polytechnic University, Hong Kong)
Sajal K. Das (Missouri University of Science and Technology, USA)

Antonio A.F. Loureiro (Federal University of Minas Gerais, Brazil)
Ana Aguiar (University of Porto, Portugal)
Christine Bassem (Wellesley College, USA)
Shuvra Bhattacharyya (University of Maryland, USA)
Dario Bruneo (Universita di Messina, Italy)
Alessandra De Paola (University of Palermo, Italy)
Pranita Dewan (IBM, USA)
Sujit Dey (University of California, San Diego, USA)
Ashutosh Dhekne (Georgia Institute of Technology, USA)
Jonathan Fink (Portland State University, USA)
Angelo Furno (IFSTTAR, ENTPE, Université de Lyon, France)
Aryya Gangopadhyay (University of Maryland Baltimore County (UMBC), USA)
Raghu Ganti (IBM T J Watson Research Center, USA)
Hassan Ghasemzadeh (Washington State University, USA)
Jason Hallstrom (Florida Atlantic University, USA)
Salil Kanhere (UNSW Sydney, Australia)
Fanxin Kong (Syracuse University, USA)
Ulf Kulau (DSI Aerospace Technology, Germany)
Francesco Longo (Universita di Messina, Italy)
Sudip Mittal (University of North Carolina Wilmington, USA)
Marco Morana (University of Palermo, Italy)
Abhishek Mukherji (Cisco Systems Inc., USA)
Paolo Nesi (DSI, University of Florence, Italy)
Biplab Pal (MachineSense, USA)
Symeon Papavassiliou (ICCS/National Technical University of Athens, Greece)
Kyung-Joon Park (DGIST, Korea)
Lucas Pereira (M-ITI / LARSyS, Portugal)
Dirk Pesch (University College Cork, Ireland)
Antonio Puliafito (University of Messina, Italy)
Carlo Puliafito (University of Florence, Italy)
Hemant Purohit (George Mason University, USA)
Maryam Rahnemoonfar (University of Maryland, USA)
Andreas Reinhardt (TU Clausthal, Germany)
Francesca Righetti (University of Pisa, Italy)
Nirupam Roy (UMD College Park, USA)
Vijay Shah (Virginia Tech, USA)
Simone Silvestri (University of Kentucky, USA)
Neeraj Suri (Technische Universitaet Darmstadt, Germany)
Eirini Eleni Tsiropoulou (University of New Mexico, USA)
Nalini Venkatasubramanian (University of California, Irvine, USA)
Antonio Virdis (University of Pisa, Italy)
Hirozumi Yamaguchi (Osaka University, Japan)
Keiichi Yasumoto (Nara Institute of Science and Technology, Japan)
Desheng Zhang (Rutgers University, USA)
Eugenio Zimeo (University of Sannio, Italy)
Nilavra Pathak (Expedia Group, Seattle, USA)
Amrita Anam (Amazon, USA)
Jorge Ortiz (The State University of New Jersey, Rutgers, USA)
Archan Misra (Singapore Management University)
Kunal Mankodiya (University of Rhode Island, USA)
Sanjukta Bhowmick (University of Nebraska Omaha, USA)
Jiaqi Gong (UMBC, USA)
Vaskar Raychoudhury (Miami University, Ohio, USA)
H M Sajjad Hossain (Microsoft AI, Cambridge MA, USA)
Daniele Riboni (University of Cagliari, Italy)
Claudio Cicconetti (CNT-IIT, Pisa)
Pablo Serrano (Universidad Carlos III de Madrid, Spain)
Marco Tiloca (SICS, Sweden)
Md Abdullah Al Hafiz Khan (Philips Research North America, USA)
Mohammad Arif Ul Alam (University of Massachusetts Lowell, USA)
Rute Sofia (Fortiss, Germany)
Hari Dubey (Microsoft, USA)

Important Dates
Paper Registration Deadline: 28 January 2020   ** EXTENDED **
Paper Submission Deadline: 14 February 2020   ** EXTENDED **
Acceptance Notification: 31 March 2020
Camera Ready Deadline: 30 April 2020

The 6th IEEE International Conference on Smart Computing (SMARTCOMP 2020)
will be held in Bologna, Italy.

For any Information about the conference, please contact the TPC Co-Chairs:
Nirmalya Roy or Carlo Vallati.

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