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Subject:
From:
Jürgen Steimle <[log in to unmask]>
Reply To:
Jürgen Steimle <[log in to unmask]>
Date:
Mon, 1 Aug 2016 17:13:49 +0200
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=== EXTENDED DEADLINE to August 9th ===

The deadline for submissions to the ACM TEI conference has been extended by one week because of problems with the TEI website. The extended deadline is August 9th, 23:59 HST.


============================
CALL FOR PAPERS
============================

TEI 2017 is the 11th annual conference on Tangible, Embedded, and Embodied
Interactions.
This year marks the first TEI conference held in Asia, It will be held in
Japan from 20th to 23th March 2017.

Conference website: http://www.tei-conf.org/17/

IMPORTANT DATES

** Extended Deadline for submissions: August 9, 2016 **
Response to authors: October 14, 2016
Camera ready submission deadline: December, 2016

GENERAL INFO

Fitting the Japanese pro-verb: 温故知新 (On-ko-chi-shin), “you need to recall
the past to understand the future”, we invite the community to present
novel work while reflecting on traditions in arts, design, and engineering.

The TEI conference has gained substantial visibility and activity over the
past decade. It brings together researchers, practitioners, businesses,
artists, designers and students from various disciplines, including
engineering, interaction design, product design, computer science, and the
arts. Application areas are diverse, including: human-augmentation,
flexible and shape changing displays, haptic interaction, interactive
surfaces, public art and performance; interactive robotics, games;
learning; planning; automotive, fashion, furniture, and architectural
design; music and sound creation; as well as productivity and creativity
tools in domains ranging from scientific exploration to non-linear
narrative.

The intimate size of this single-track conference provides a unique forum
for exchanging ideas and presenting innovative work through talks,
demonstrations, posters, art installations and performances, and
participating in hands-on studio/workshops.

Accepted submissions will be included in the ACM digital library
proceedings.


SUGGESTED TOPICS FOR PAPER SUBMISSIONS

Authors are invited to submit high-quality work detailing original research
that contributes to advancing this rapidly developing field. Appropriate
topics include but are not limited to:

• Novel interaction techniques that bridge the physical and digital worlds
• Theoretical foundations, frameworks, and concepts
• Flexible and shape changing displays
• Wearable technologies beyond the smartwatch
• Movement and choreography of interaction
• Meta-studies on tangible and embodied interactions
• Tools and toolkits for tangible and embodied interaction
• Novel application areas; industrial applications and implications
• Role of physicality in embodied sense-making (e.g., human perception,
cognition and experience)
• Methodologies specific to tangible and embodied interaction
design/research (including design guidelines, methods, approaches, lessons
learned)
• Case studies and evaluations of working deployments
• Tangible interaction for artistic and/or expressive systems
• Philosophical, ethical and social implications
• Key challenges and opportunities; proposals for research agendas and
dissemination


SUBMISSIONS

Papers should be between 4 pages and 8 pages long in the two-column ACM
SIGCHI format. They must be in PDF file format. All papers will undergo the
same a double-blind process and be published in the same way. Length must
match the contribution, and the same general criteria hold for all papers.
Regardless of length, a paper may be presented as a talk, demo and/or
poster. When submitting your paper, we want to emphasize that providing a
supplementary two-minute video (if appropriate) will not only facilitate
the review process, but also increase the visibility of the work, during
and after the conference.

For more information: http://www.tei-conf.org/17/papers.html

PROGRAM CHAIRS

Juergen Steimle, Saarland University (Germany)
Orit Shaer, Wellesley College (USA)
Kai Kunze, Keio University (Japan)
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