ACM SIGMM Interest List


Options: Use Classic View

Use Proportional Font
Show HTML Part by Default
Show All Mail Headers

Topic: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Daniel Casini <[log in to unmask]>
Mon, 27 Mar 2023 06:04:46 -0700
text/plain (5 kB) , text/html (6 kB)
*Call for Papers- HSTIEC: Hardware, Software, and Tools for the
IoT-to-Edge-to-Cloud Continuum - DSD (Euromicro Conference on Digital
System Design) 2023 *

   - When: Sep 6, 2023
   - Sep 8, 2023
   - Where: Durres, Albania
   - *Submission Deadline: Apr 17, 2023*
   - Notification Due: May 29, 2023
   - Final Version Due: Jun 16, 2023


*Special Session Scope*

Modern applications require more and more interconnected systems, merging
IoT, Edge, and Cloud technologies into a unified computing paradigm called
the IoT-to-Edge-to-Cloud continuum. Many application domains can benefit
from the adoption of this paradigm, ranging from automotive (including
autonomous driving) to intelligent industrial systems, smart manufacturing,
smart cities, robotics, smart farming, and more.
These application domains often require the deployment of complex
cyber-physical systems that need to accurately sense the environment,
perform convoluted processing, and actuate control decisions. These
activities are very likely to occur on different processing nodes. For
example, some advanced computations may rely on heavyweight algorithms
based on artificial intelligence, which cannot be entirely handled on
embedded platforms, and Edge computing in general due to resource
constraints. Furthermore, modern applications are expected to be
characterized by the presence of highly heterogeneous nodes that exchange
massive amounts of data across the continuum, and inevitably end up needing
to comply with non-functional requirements such as privacy preservation,
security, safety, energy consumption, and real-time computation.
The IoT-to-Edge-to-Cloud continuum poses new challenges that need to be
properly addressed with ad-hoc hardware and software technologies, as well
as tools allowing for designing and managing such massively distributed
cyber-physical systems.


*Papers are published by IEEE in the DSD (Euromicro Conference on Digital
System Design) 2023 proceedings*


Papers on any of the following and related topics can be submitted to the

- Hardware technologies for ultra-low latency communication (5G and more);
- Hardware-software codesign techniques for the compute continuum;
- Hardware acceleration technologies for distributed offloading;
- Orchestrators and tools for managing the IoT-to-Edge-to-Cloud continuum;
- Middleware framework extensions (DDS, MQTT, ROS, CyberRT,…) to cope with
context-specific non-functional requirements;
- Mechanisms for the interoperability between different communication
standards in heterogeneous distributed systems;
- Tool for optimizing the deployment of largely-distributed applications;
- Tool for analyzing performance criteria related to non-functional
requirements in the compute continuum;
- Energy-aware hardware and software to foster a greener compute continuum;
- Safety, security, and real-time performance in distributed applications;
- Virtualization technologies;
- Hardware and software technologies for implementing distributed AI
applications on the compute continuum;
- AI techniques for managing distributed applications.

*Submission Guidelines*

Authors are encouraged to submit their manuscripts via EasyChair web
service at web page The
manuscript should conform to the IEEE format: single spaced, double column,
US letter page size, 10-point size, Times Roman font, up to 8 pages. The
review process is double-blind, i.e., the authors’ identities must not be
revealed in the manuscript.

*Special Session Chairs*

- Daniel Casini (Scuola Superiore Sant’Anna, Pisa, Italy)
- Alessandro Biondi (Scuola Superiore Sant’Anna, Pisa, Italy)

*Special Session Program Committee*

- Daniel Bristot de Oliveira, Red Hat, Inc.
- Stefano Di Carlo, Politecnico di Torino
- Zheng Dong, Wayne State University
- Enrico Mezzetti, Barcelona Supercomputing Center
- Saad Mubeen, Mälardalen University
- Geoffrey Nelissen, TU Eindhoven
- David Pereira, CISTER Unit / INESC TEC & ISEP IPP
- Francesco Restuccia, University of California, San Diego
- Dimitrios Pliatsios, University of Western Macedonia
- Manisha Luthra, TU Darmstadt
- Alexandros Apostolos Boulogeorgos , Innocube
- Annachiara Ruospo, Politecnico di Torino
- Davide Calvaresi, University of Applied Sciences Western Switzerland

*Contact Information*

- Daniel Casini, email: [log in to unmask]
- Alessandro Biondi, email: [log in to unmask]



[log in to unmask]

If you don't already have a password for the LISTSERV.ACM.ORG server, we recommend
that you create one now. A LISTSERV password is linked to your email
address and can be used to access the web interface and all the lists to
which you are subscribed on the LISTSERV.ACM.ORG server.

To create a password, visit:


Once you have created a password, you can log in and view or change your
subscription settings at: