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Christos Douligeris <[log in to unmask]>
Mon, 25 Sep 2023 17:49:30 +0300
text/plain (7 kB) , text/html (10 kB)
The firm deadline is October 9, 2023.
Looking forward to receiving your papers and seeing all of you in 
Piraeus (Port of Athens), Greece.
Prof. Christos Douligeris
PS Sorry for multiple emails.
>
>
>   Call for Papers
>
> SEEDA-CECNSM 2023
>
> We cordially invite you to submit your papers and attend the 8th 
> South-East Europe Design Automation, Computer Engineering, Computer 
> Networks and Social Media Conference (https://seeda2023.unipi.gr), 
> which will be held in *Piraeus, Greece, November 10th-12th 2023*. This 
> year the conference will be organized by the University of 
> Piraeus-Department of Informatics, Greece, by the University of 
> Western Attica-Department of Informatics and Computer Engineering, 
> Greece and by the University of Thessaly-Department of Computer 
> Science and Biomedical Informatics, Greece.
>
> The 8th South-East Europe Design Automation, Computer Engineering, 
> Computer Networks and Social Media Conference (SEEDA-CECNSM 2023), in 
> its 8th year, will provide an insight into the unique world stemming 
> from the interaction between the fields of computer engineering, 
> networks and design automation (DA). SEEDA-CECNSM 2023 will provide an 
> international technical forum for experts from the engineering 
> industry and academia to exchange ideas, innovations, and present 
> results of on-going research in the most state-of-the-art areas. This 
> year, special focus will be on the challenging issues related to all 
> the opportunities of computer engineering, networks and design 
> automation in the era of the integration of Machine Learning 
> Techniques, *Internet of Things*, *Cloud Computing* and 
> *Cyber-Physical Systems*.
>
> SEEDA-CECNSM 2023 will be *technically co-sponsored by the IEEE 
> Computational Intelligence Society * and all papers will be indexed by 
> *IEEE Xplore*, *DBLP* and *Scopus*.
>
> *TOPICS OF INTEREST*
>
> *Design Automation (DA)*
>
>   * Artificial Intelligence and Applications
>   * Backend Silicon Tools and Methodologies
>   * CAD Tools and Algorithms
>   * Characterization and Timing Simulation
>   * Design for Low Power
>   * Design Optimization and Implementation
>   * ESL Methodologies and EDA Tools
>   * FPGAs, ASICs, ASIPs and SoCs
>   * Numerical and Scientific Computation
>   * Open-Source Tools
>   * Placement & Routing
>   * Rapid Prototyping and Hardware/Software Co-verification and Co-design
>   * Silicon Device Level Research
>   * System-Level and High-Level Synthesis
>   * VLSI and Digital Design and Design for Test
>   * Reconfigurable computing and FPGA-based acceleration
>   * Approximate computing
>   * System level and architecture level dependability
>   * Safe and secure embedded systems
>
> *Computer Networks and Communications*
>
>   * Advances in Internet Protocols
>   * Cloud and Fog Computing
>   * Intelligent Agents and Distributed Computing
>   * Internet of Things and Smart Cities
>   * Internet Services and Applications
>   * Management of Telecommunications and Networks
>   * Mobile, Ad Hoc and Sensor Network Optimization and Management
>   * Security and Privacy
>   * Ubiquitous Computing, Services and Applications
>   * Web Services and Service Oriented Architectures
>   * Wireless, Cellular, and Mobile Communications
>   * Machine Learning Techniques in Communications and Networking
>
> *Computer Engineering*
>
>   * Computer Architecture and Design
>   * Formal Methods in Architecture Design
>   * Computer-Aided Architecture Design and Implementation
>   * Embedded Systems and Applications
>   * Multi-core VLSI/ULSI Design
>   * Parallel and other Advanced Architectures
>   * Distributed Computing
>   * Memory and Storage Systems
>   * Parallel programming, parallel computing and ILP
>   * Advanced I/O device design
>   * Human-Computer Interaction
>   * Embedded and Cyber-Physical Systems
>   * Industrial informatics
>   * Heterogeneous many/multi-core computing
>
> *Social Media and e-technologies*
>
>   * Active and Collaborative Learning
>   * Game-Based Learning for Engineering Education
>   * Social Networks in Education
>   * Advances in e-Energy Design and Development
>   * Digital Media Technologies
>   * e-Commerce and e-Services
>   * Economic and Regulatory Issues
>   * e-Government Issues
>   * e-Health Technologies and Applications– Social Networks,
>     Crowdsourcing, and Crowdsensing
>   * Image Processing and Visualization
>
> *Social Media and e-technologies*
>
>   * Active and Collaborative Learning
>   * Game-Based Learning for Engineering Education
>   * Social Networks in Education
>   * Advances in e-Energy Design and Development
>   * Digital Media Technologies
>   * e-Commerce and e-Services
>   * Economic and Regulatory Issues
>   * e-Government Issues
>   * e-Health Technologies and Applications– Social Networks,
>     Crowdsourcing, and Crowdsensing
>   * Image Processing and Visualization
>
> *Submission Guidelines*
> (1) Review manuscripts should describe original work and should be no 
> more than 8 pages in the IEEE double column proceedings format 
> including tables, figures and references. Note that accepted papers up 
> to 6 pages will be published with no additional charge. Exceeding 
> pages will be charged an additional fee. Only registered and presented 
> papers will be published in the conference proceedings. Please use the 
> IEEE template as described here 
> <https://www.ieee.org/conferences/publishing/templates.html>.
> (2) All papers for SEEDA-CECNSM 2023 should be submitted via EasyChair 
> using
> https://easychair.org/conferences/?conf=seedacecnsm20230.
> (3) Proposals for special sessions should be sent to [log in to unmask]
>
> *Publication*
> Accepted papers will be included in the SEEDA-CECNSM 2023 Proceedings 
> and will be submitted for inclusion to the IEEE Xplore. The 
> SEEDA-CECNSM Proceedings have been indexed in the past by dblp and 
> Scopus. This makes the SEEDA-CECNSM conference one of the publication 
> venues with very high visibility and impact in both Computer and 
> Communications areas.
>
> *Important Dates*
>
>   * Paper Submission Deadline: October 8, 2023
>   * Notification of paper acceptance: October 20 2023
>   * Camera-Ready Papers Due: October 31 2023
>   * Conference: November 10-12 2023
>
> *Conference Chairs*
>
>   * Christos Douligeris, University of Piraeus
>   * Ioannis Vogiatzis, University of West Attica
>   * Markos G. Tsipouras, University of Western Macedonia
>   * Michael Dossis, University of Western Macedonia
>   * Alexandros T. Tzallas, University of Ioannina
>
> *Technical Program Committee Co-Chairs*
>
>   * Athanasios Kakarountas, University of Thessaly
>   * Michalis Psarakis, University of Piraeus
>   * Cleio Sgouropoulou, University of West Attica
>   * Theodoros Karvounidis University of Piraeus
>

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