(Our sincere apologies if you receive multiple copies)

Note that dates have been finalized:
- the (STRICT) submission deadline is NOVEMBER 11, 2003;
- the conference dates are 5-8 April, 2004.
 ________________________________________________________________________

                          FINAL CALL FOR PAPERS

                                WEB3D 2004:
          The 9th International Conference on 3D Web Technology

            Sponsored by ACM SIGGRAPH & the Web3D Consortium

                   5-8 April 2004, Monterey California USA

                        http://www.web3d.org/s2004
 ________________________________________________________________________

 DEADLINES
     PAPERS Submission:                    NOVEMBER 11, 2003
     Notification:                         December 19, 2003
     Camera-Ready Version:                 January  12, 2004
     Conference Dates:                       April 5-8, 2004


 CONFERENCE INFORMATION:
 Ninth in a series, the Web3D 2004 Symposium will focus on every aspect
 of 3D technologies on the Internet, ranging from languages, tools and
 high performance 3D graphics to human-computer interaction issues
 and the latest mobile applications.
 The annual Web3D Symposium is a major event which unites researchers,
 developers, experimenters, and content creators in a dynamic learning
 environment.  Attendees share and explore methods of using, enhancing,
 or creating new 3D Web technology such as X3D, VRML, MPEG4, OpenHSF,
 and Java3D.

 Authors are invited to submit their work for careful review by the
 International Program Committee. Both research and applications papers
 are of interest to Web3D 2004.
 All content must be innovative and meaningful to the advancement of
 3D technologies on the Web. Topics of interest include but are not
 limited to:
 * 3D graphics for wireless PDAs and cellular phones
 * Animated humanoids and complex reactive characters
 * Computer Aided Design technology and methods for lossless
   cross-application data exchange
 * Geometry/object behaviors in Web3D settings
 * High performance 3D graphics for distributed environments
   and tele-operation systems
 * Innovative user interface paradigms for navigating real-time
   3D graphics environments and Web3D worlds
 * Interaction methods for Web-based 3D graphics systems
 * Methods for designing, representing, interacting with, and
   visualizing complex geometry and structure
 * Multimodal user interaction in Web3D worlds
 * Specifications, languages, or abstractions for specifying 3D geometry
   and their behaviors

 SUBMISSION INSTRUCTIONS:
 Submit short papers of up to 9 pages (including figures and
 references) in PDF format by 11:59pm PST, NOVEMBER 11, 2003 via
 the Symposium Web Page. Papers must be formatted using the
 document templates for Conferences sponsored by ACM SIGGRAPH
 (http://www.siggraph.org/publications/instructions/index.html#smconf).
 After acceptance, the final revised paper is required also
 in electronic form.

 PUBLICATION:
 Accepted papers will appear in the Conference Proceedings,
 published by ACM Press.

 CONFERENCE CHAIR:
     * Don Brutzman, Naval Postgraduate School, USA

 PROGRAM CHAIRS:
     * Luca Chittaro, HCI Lab, University of Udine, Italy
     * Richard Puk, Intelligraphics Inc., USA


PROGRAM COMMITTEE (additional members will be added soon):

Marc Alexa, Technische Universitat Darmstadt, Germany
Christian Bouville, France Telecom R&D, France
Wolfgang Broll, Fraunhofer FIT, Germany
Len Bullard, Intergraph Public Safety, USA
George S. Carson, GSC Associates, USA
Raimund Dachselt, Technical University of Dresden, Germany
Samuel DeGrande, University of Lille, France
Ivan Herman, W3C
Zhisheng Huang, Vrije University Amsterdam, the Netherlands
Nigel John, University of Wales, UK
Jan Kautz, Massachusetts Institute of Technology, USA
Hyeong-Seok Ko, Seoul National University, Korea
Nadia Magnenat-Thalmann, MIRALab, Switzerland
Igor Pandzic, University of Zagreb, Croatia
Tony Parisi, Media Machines, USA
Nicholas Polys, Virginia Tech, USA
Mark Pullen, George Mason University, USA
Kari Pulli, Nokia Research, Finland
Roberto Ranon, University of Udine, Italy
Sandy Ressler, NIST, USA
George Uffenorde, Boeing, USA