Call for Papers - Special Issue on Backscatter and Reconfigurable
Intelligent Surface Empowered Wireless Communications in 6G - IEEE VT
Magazine (Impact Factor: 7.921)

Manuscript Submission by: 29 July 2021

Though the fifth generation (5G) mobile network system is rolled out
worldwide, research attention in both academia and industry has shifted to
the sixth generation (6G). Exciting new applications—such as multisensory
XR applications, connected robotics and autonomous systems, and
brain-computer interactions—will expect support from 6G communications.
These cutting edge applications pose new challenges to the requirements of
data rate, latency, connectivity density, and energy efficiency, which
cannot not be tackled by current 5G technologies. The main principles of 5G
technologies lie in increasing the number of antennas, migrating high
frequency bands and deploying more access points. Although significant
performance gains can be achieved in terms of spectrum efficiency, they
have drawbacks such as high power and hardware cost, increased network
maintenance cost, and excessive signal processing complexity. Hence, new
transformative transmission technologies need to be developed to support
these new applications and services.

Due to recent advancements in micro-electro-mechanical systems (MEMS) and
metamaterials, ambient backscatter communication (AmBC) and reconfigurable
intelligent surface (RIS)-aided wireless communication have received
extensive research attention. Unlike traditional wireless communication
systems, AmBC does not need an active radio frequency (RF) component on the
tag, and it can harvest energy from ambient RF sources in the radio
environment. Therefore, AmBC requirements are low-cost and could be
deployed ubiquitously. In addition, the RIS, which consists of a number of
passive reflecting elements, can reconfigure the wireless propagation
environment by carefully tuning the phase shifts of the reflecting
elements, and thus can customize wireless channels based on design
objectives. The RIS can be small and lightweight, enabling low-cost
installation on indoor ceilings and walls, as well as street lamps. Due to
these appealing advantages, AmBC and RIS have been recognized as some of
the most promising techniques in 6G networks.

Research on AmBC and RIS is still in its infancy. This special issue is
soliciting recent contributions that address the major challenges in
channel modeling, analysis, optimization, and implementation of AmBC and
RIS empowered wireless communication systems. Topic of interest include but
are not limited to:

- Channel modelling for AmBC and/or RIS-aided wireless networks
Communication-theoretic foundation and analysis of AmBC and/or RIS-aided
wireless networks
- Algorithms and protocol design for AmBC and/or RIS-aided wireless networks
- Deployment optimization for AmBC and/or RIS-aided wireless networks
- Integration of AmBC and/or RIS into emerging wireless communication
applications such as wireless power transfer, mobile edge computing,
physical layer security, unmanned aerial vehicle communications, etc.
- Localization and sensing for AmBC and/or RIS-aided communications
- Energy efficient design for AmBC and/or RIS-aided communications
- Application of AmBC and/or RIS in high-frequency communications, such as
mmWave/Terahertz communication and visible light communication
- AI-empowered AmBC and/or RIS-aided communication systems
- Testbeds, experimental measurements in AmBC and/or RIS-aided wireless

All manuscripts should contain state-of-the-art material presented in a
tutorial or survey style, and must adhere to IEEE VTM guidelines at Authors should submit a
PDF version of their manuscript to (select Special Issue when submitting)

Call for papers available at:
Important Dates
Manuscript Submission by: 29 July 2021
First Round Reviews by: 28 October 2021
Second Round Submissions by: 23 December 2021
Second Round Reviews / Editorial Decision: 22 February 2021
Final Articles by: 4 March 2021
Publication: June 2022

Guest Editors
Cunhua Pan (lead), Queen Mary University of London, UK
Marco Di Renzo, Paris-Saclay University, France
Chau Yuen, SUTD, Singapore
Derrick Wing Kwan Ng, UNSW, Australia
Ertugrul Basar, Ko University, Turkey



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