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March 29 - 30, 2022 | Tainan, Taiwan
NEW Submission Deadline: December 1, 2021

SCOPE

6G-xCOM solicits research papers with innovative ideas or preliminary contributions to the field of 6G telecommunications. Its mission is to bring together researchers from both academic and industry to exchange early ideas and facilitate in-depth discussions for future 6G standards currently under development.

This 6G-xCOM 2022 conference, is the first attempt of an annual series as one of the premier 6G forums for looking beyond 5G. The conference encourages submissions on all technical aspects of beyond 5G technologies, including but not limited to extreme communications, ubiquitous communications with always-on connectivity, intelligent networking management technologies, 6G applications.

We are pleased to invite you to submit your paper to EAI 6G-xCOM 2022. Submissions should be in English, following the Springer formatting guidelines (see Submission). 

Submit Paper

Read moreCall for Papers

PUBLICATION

All registered papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library.

Proceedings will be submitted for inclusion in leading indexing services, such as Web of Science, Compendex, Scopus, DBLP, EU Digital Library, Google Scholar, IO-Port, MathSciNet, Inspec, and Zentralblatt MATH.

Authors of selected papers will be invited to submit an extended version to:

All accepted authors are eligible to submit an extended version in a fast track of:

Additional publication opportunities:

IMPORTANT DATES

FULL PAPER SUBMISSION DEADLINE: DECEMBER 1, 2021

NOTIFICATION DEADLINE: JANUARY 3, 2022

CAMERA-READY DEADLINE: JANUARY 30, 2022

CONFERENCE DATES: MARCH 29 - 30, 2022

ORGANIZING COMMITTEE

General Chairs
John C.S. Lui - Chinese University of Hong Kong, China
Chi-Yu Li - National Yang Ming Chiao Tung University, Taiwan

Technical Program Committee Chairs
Chunyi Peng - Purdue University, USA
Antonio De La Oliva - University Carlos III of Madrid, Spain

See the full Organizing Committee and Technical Program Committee.  

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